Network Attached Processor Module for High-Density Computing
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Solution Overview
Problem
Conventional enterprise class computing systems are inadequate for handling large data sets due to their high physical space requirements, significant power consumption, and cooling needs, which lead to increased operating costs, especially as services migrate to cloud computing.
Innovation Solution
A network attached processor system with a high-density form factor, featuring a processor module with programmable circuitry, multiple RAM devices, and an interface for external connectivity, allowing for parallel channels and dynamic reconfiguration to optimize computing resources and reduce power usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional enterprise computing systems are used to provide large computational power, then processing capability is improved, but physical space consumption increases
Solution Approach 1:
The patent combines multiple computing resources (processors, memory, I/O interfaces) into a single integrated network attached processor module. This consolidation merges previously separate computing functions into one compact unit that can be densely packed in rack-mounted configurations, providing enterprise-class computational power in a space-efficient form factor.
Solution Approach 2:
The network attached processor module is designed as a universal computing platform that can perform multiple functions including data processing, storage, and network communication. The programmable logic device can be configured to implement different computational tasks, making the system adaptable to various workloads while maintaining a compact physical footprint.
2Productivity
If conventional enterprise computing systems are used to provide large computational power, then processing capability is improved, but power consumption increases
Solution Approach 1:
By consolidating computing, memory, and I/O functions into a single integrated module, the patent reduces the total power consumption associated with multiple separate components. The close integration allows for more efficient power distribution and reduced overhead, delivering high computational power with lower overall energy usage.
3Productivity
If conventional enterprise computing systems are used to provide large computational power, then processing capability is improved, but cooling requirements increase
Solution Approach 1:
The integrated module design consolidates heat-generating components into a compact unit with a smaller thermal footprint. This allows for more efficient heat dissipation and reduced cooling requirements compared to distributed conventional systems, while maintaining high computational throughput.
4Area of stationary object
If high density of computing resources is implemented, then space efficiency is improved, but device complexity increases
Solution Approach 1:
The patent divides the computing system into standardized, modular network attached processor units that can be independently configured and deployed. Each module contains segmented functional blocks (programmable logic, memory, I/O interfaces) that can be independently managed, reducing the operational complexity despite high density.
Solution Approach 2:
The system uses programmable logic devices that can be dynamically reconfigured to change computational parameters and functionality. This flexibility allows the same physical hardware to adapt to different computational tasks, reducing the need for multiple specialized devices and simplifying system management.
Data Source
AI summary
A processor module can include a circuit board, a first programmable circuitry coupled to the circuit board, wherein the first programmable circuitry is configurable to implement different physical circuits, and a processor configured to execute program code. The processor can be coupled to the circuit board and to the first programmable circuitry. The processor module also can include random access memory (RAM) devices coupled to the circuit board and electrically coupled to the first programmable circuitry. The RAM devices can be coupled to the first programmable circuitry to form parallel channels of the RAM devices. The processor module further can include an interface coupled to the circuit board and electrically coupled to the first programmable circuitry for coupling input and output between the first programmable circuitry and external circuitry.