Network Equipment Temperature Control Using Reversible Cooling Chips
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Solution Overview
Problem
Conventional temperature control systems for network communication equipment face inefficiencies in maintaining optimal operating temperatures, leading to increased power consumption, reduced fan lifetime, and noise due to indiscriminate cooling methods, especially when not all components require cooling.
Innovation Solution
A smart temperature control system that uses cooling chips to adjust temperatures of specific components by engaging with a heat dissipating plate, controlled by a CPU circuit that manages power polarity to cool or heat components as needed, maintaining optimal operating ranges without increasing fan speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the fan rotation speed is increased to strengthen cooling effect, then the cooling performance is improved, but power consumption increases, fan lifetime is reduced, and high-frequency noise is generated
Solution Approach 1:
The patent applies local quality by implementing selective cooling for different components based on their thermal sensitivity. The system divides components into thermally sensitive components (requiring cooling) and non-thermally sensitive components (not requiring cooling), and applies cooling resources only where needed rather than uniformly across all components, thereby reducing overall power consumption while maintaining effective cooling performance.
Solution Approach 2:
The patent implements dynamics by making the fan rotation speed adjustable and controllable based on real-time temperature monitoring. The system dynamically adjusts fan speed according to actual thermal conditions and component requirements, rather than operating at fixed high speed, which reduces power consumption and extends fan lifetime while maintaining adequate cooling performance.
2Temperature
If the fan rotation speed is increased to strengthen cooling effect, then the cooling performance is improved, but fan lifetime is reduced
Solution Approach 1:
The system dynamically adjusts fan rotation speed based on actual thermal conditions and component requirements. By operating the fan at lower speeds when full cooling capacity is not needed, the mechanical wear and stress on the fan are reduced, thereby extending its operational lifetime while still maintaining adequate cooling performance when required.
Solution Approach 2:
The patent applies local quality by implementing selective cooling for different components based on their thermal sensitivity. The system divides components into thermally sensitive components (requiring cooling) and non-thermally sensitive components (not requiring cooling), and applies cooling resources only where needed rather than uniformly across all components, thereby reducing overall power consumption while maintaining effective cooling performance.
3Temperature
If the fan rotation speed is increased to strengthen cooling effect, then the cooling performance is improved, but high-frequency noise is generated
Solution Approach 1:
The patent implements dynamics by making the fan rotation speed adjustable and controllable based on real-time temperature monitoring. The system dynamically adjusts fan speed according to actual thermal conditions and component requirements, rather than operating at fixed high speed, which reduces power consumption and extends fan lifetime while maintaining adequate cooling performance.
Solution Approach 2:
The patent applies local quality by implementing selective cooling for different components based on their thermal sensitivity. The system divides components into thermally sensitive components (requiring cooling) and non-thermally sensitive components (not requiring cooling), and applies cooling resources only where needed rather than uniformly across all components, thereby reducing overall power consumption while maintaining effective cooling performance.
4Temperature
If indiscriminate cooling is applied to all components, then cooling coverage is improved, but power consumption increases
Solution Approach 1:
The patent applies local quality by implementing selective cooling for different components based on their thermal sensitivity. The system divides components into thermally sensitive components (requiring cooling) and non-thermally sensitive components (not requiring cooling), and applies cooling resources only where needed rather than uniformly across all components, thereby reducing overall power consumption while maintaining effective cooling performance.
Solution Approach 2:
The patent implements partial action by applying cooling only to the extent necessary for thermally sensitive components rather than uniformly to all components. The system provides adequate cooling coverage for components that require it while avoiding unnecessary cooling for components that do not, thereby optimizing power consumption while maintaining sufficient cooling coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficient temperature management of components within network equipment, reducing power consumption and extending fan life by targeted cooling or heating, while minimizing noise and maintaining operational efficiency.
Implementation Method 1
contact a surface of the cooling chip with a plate of a case serving as a heat dissipating plate having a large area or a cooling plate, allowing the cooling chip to cool or heat the temperature-controlled member via another surface of the cooling chip
Implementation Method 2
The at least one cooling chip is engaged between the plate and a portion of the motherboard where the at least one temperature-controlled member is disposed on, and is electrically connected to the power-driving circuit to be driven by the power-driving circuit via a voltage with a first polarity or a voltage with a second polarity opposite to the first polarity
Data Source
AI summary
A smart temperature control system of a network equipment includes a motherboard disposed on a plate of a case, wherein a cooling chip is disposed between the plate and a portion of the motherboard where a temperature-controlled member is disposed on. A system CPU controlling circuit on the motherboard receives an information of a real-time temperature and a model of the temperature-controlled member, and obtains an operating temperature range of the temperature-controlled member by comparing the information of the model of the temperature-controlled member received with different models of the temperature-controlled member in a memory. When the real-time temperature of the temperature-controlled member falls out of the operating temperature range of the temperature-controlled member, the system CPU controlling circuit controls a power-driving circuit to drive the cooling chip via voltages with opposite polarities to cool or heat the motherboard and the temperature-controlled member disposed on the motherboard.