Programmable Network Processor Packaging for Low-Latency Memory Access
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Solution Overview
Problem
Conventional solutions for data processing applications in networking, data centers, and storage systems rely on expensive external memory devices with high latency, limiting bandwidth and performance due to the need for high-capacity, low-latency memory access.
Innovation Solution
The implementation of multi-die single-package systems with a network processor coupled to a base die containing low-latency memory, utilizing a high-speed interface like 2.5D or 3D interconnects, and incorporating programmable logic fabric with sector-aligned memory and network-on-chip (NOC) circuitry for dynamic reconfiguration and improved bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If external memory devices are used for high-capacity data storage, then storage capacity is improved, but memory access latency increases and bandwidth is limited
Solution Approach 1:
The patent combines multiple separate components (network processor die, memory die, and interconnect structures) into a single integrated package. This merging allows high-capacity memory to be physically closer to the network processor, reducing access latency while maintaining high capacity. The 2.5D/3D interconnect technology enables direct integration of memory stacks with the processor die within the same package footprint.
Solution Approach 2:
The patent transitions from traditional 2D planar integration to 2.5D and 3D vertical stacking architectures. By stacking memory dies vertically above the processor die and using through-silicon vias (TSVs) for interconnection, the system achieves higher memory capacity in a smaller footprint while reducing access path length, thereby lowering latency and increasing bandwidth.
2Quantity of substance
If external memory devices are used, then high capacity is achieved, but system bandwidth and processing performance deteriorate
Solution Approach 1:
The integration of memory and processor within the same package creates high-speed memory interfaces with multiple wide data buses. The 2.5D/3D architecture enables parallel access paths through TSVs, significantly increasing bandwidth compared to external memory connections. This merging eliminates the bandwidth bottleneck associated with external memory interfaces.
Solution Approach 2:
The patent introduces high-speed interconnect structures (2.5D interposer or 3D TSVs) as intermediaries between the processor die and memory die. These interconnect technologies provide high-bandwidth communication channels that enable fast data transfer rates, serving as efficient mediators that maintain high productivity while supporting large memory capacity.
3Loss of time
If multi-die single-package systems are implemented, then memory latency is reduced and bandwidth is improved, but device complexity increases
Solution Approach 1:
The patent segments the system into distinct functional dies (processor die, memory die, interconnect die) that can be independently designed, manufactured, and tested. This segmentation allows each component to be optimized separately while maintaining overall system performance. The modular approach manages complexity by dividing the integrated system into manageable units with standardized interfaces.
Solution Approach 2:
The 2.5D/3D interconnect structures serve multiple functions: they provide mechanical support, electrical interconnection, thermal management pathways, and signal routing. This multi-functionality reduces the need for separate components, thereby managing overall device complexity while achieving low latency and high bandwidth performance.
Data Source
AI summary
This disclosure relates to integrated circuit devices that may include a network processor in a data processing die and an on-package memory in a base die. The data processing die may implement one or more network functionalities that may exchange data with low-latency memory, high capacity in the base die. The data processing die may be programmable fabric, which may be dynamically reconfigured during operation.