High-Density Neural Connectors With Shaped Alignment Profiles
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Solution Overview
Problem
Conventional neuromodulation devices face challenges in achieving high-density neural interfaces due to limitations in connector density and complexity, which restrict the number of electrodes and require permanent connections that are difficult to upgrade or maintain.
Innovation Solution
The development of connectors with a core and supporting structure wrapped in dielectric materials, featuring conductive traces and a predetermined shape for alignment, enables reliable and non-permanent connections between lead assemblies and neurostimulators, allowing for higher electrode counts and flexible design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of electrodes is increased to interface with larger tissue volumes, then the coverage and therapeutic capability are improved, but the number of channels or wires needed increases, leading to increased connector complexity and difficulty in maintaining reliable connections
Solution Approach 1:
The connector integrates multiple functional elements including conductive contacts, insulating layers, and alignment features within a compact nested structure. The header receives the connector with multiple contacts arranged in a dense configuration, allowing high channel counts without proportionally increasing overall device complexity.
Solution Approach 2:
The connector transitions from linear wire arrangements to a multi-dimensional contact array within the header. Contacts are arranged in multiple planes and orientations, enabling high-density connections by utilizing three-dimensional space rather than simple linear extensions.
2Reliability
If permanent connections are used to ensure reliability, then connection stability is improved, but the ability to upgrade electronics or replace batteries is lost, reducing adaptability
Solution Approach 1:
The connector is designed with dynamic characteristics including spring-loaded contacts and flexible printed circuit boards that maintain reliable electrical connection while allowing mechanical disconnection. This enables the lead assembly to be permanently implanted in tissue while the connector interface remains removable for electronics upgrades.
Solution Approach 2:
The system is segmented into three distinct components: the electrode array permanently implanted in tissue, the lead assembly with cable connecting electrodes to connector, and the header with electronics that can be replaced. The connector serves as the interface between these segments, maintaining reliability during use while enabling separation for maintenance.
3Productivity
If more channels or wires are added to support high electrode counts, then the functional capability is improved, but the size of the connector and lead assembly increases, making implantation more invasive
Solution Approach 1:
The connector utilizes flexible printed circuit boards and thin-film construction to achieve high channel density in a compact form factor. Multiple conductive traces are layered within thin dielectric materials, enabling numerous channels without increasing the overall volume of the implanted device.
Solution Approach 2:
The connector employs composite construction combining flexible polymers, conductive traces, and dielectric layers. This multi-material approach allows high channel counts while maintaining flexibility and minimizing size, as the composite structure efficiently packs multiple functions into a small volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides increased contact points, a smaller footprint, and greater design flexibility, enabling scalable connections for multiple electrodes and minimizing invasive procedures by allowing for miniaturization and easier access to anatomies.
Implementation Method 1
a low temperature liquid crystal polymer that is reflowed to attach the supporting structure to the core
Data Source
AI summary
The present disclosure relates to connectors for high density neural interfaces and methods of microfabricating the connectors. Particularly, aspects of the present disclosure are directed to a connector having a core and a supporting structure wrapped around at least a portion of the core. The supporting structure may have a first layer of a high temperature liquid crystal polymer, and the second layer of a low temperature liquid crystal polymer that is reflowed to attach the supporting structure to the core. Conductive traces are buried between the first layer and the second layer, and the conductive traces terminate at conductive contacts formed on a surface of the first layer. The connector may have a predetermined shape or profile, which facilitates alignment and insertion of the connector into a header of a neurostimulator.