Implantable Neural Electrode Interface Platform Manufacturing

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Solution Overview

Problem

Current methods for manufacturing implantable neural electrode interfaces face challenges in creating durable, flexible, and efficiently connectable electrodes that can effectively stimulate or record neural activity without causing tissue damage or disintegration over time.

Innovation Solution

A method involving a metal layer sandwiched between adhesive silicone layers, with the metal layer cut to form electrode sites, traces, and contact pads, and exposed through holes in the silicone layers, allowing for secure welding of wires and a detachable needle for insertion into neural tissue, ensuring structural integrity and ease of handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a metal layer is used to form electrode sites and traces, then electrical conductivity and structural integrity are improved, but the flexibility and ease of handling are worsened

Engineering Contradiction:
Improvestructural integrityVSAvoidease of handling
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The patent uses a composite structure combining a flexible polymer substrate with a metal layer deposited on top. The polymer substrate (e.g., silicone or polyimide) provides flexibility and ease of handling, while the metal layer (e.g., platinum, iridium, or aluminum) provides electrical conductivity and structural integrity for electrode sites and traces. This composite approach resolves the contradiction by allowing the device to be both flexible and structurally sound.

Inventive Principle:
Principle #40Composite materials

2Ease of operation

If the metal layer is made thinner to improve flexibility, then ease of handling is improved, but manufacturing precision and reliability are worsened

Engineering Contradiction:
ImproveflexibilityVSAvoidmanufacturing precision
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent specifies precise thickness parameters for the metal layer (typically 5-50 micrometers) and the polymer substrate to optimize both flexibility and manufacturability. By carefully controlling these dimensional parameters, the invention achieves a balance where the metal layer is thin enough to provide flexibility but thick enough to maintain manufacturing precision, reliability, and electrical performance.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If adhesive silicone layers are used to sandwich the metal layer, then reliability and structural integrity are improved, but the complexity of the manufacturing process is worsened

Engineering Contradiction:
Improvestructural integrityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the metal layer with the polymer substrate through direct deposition or lamination processes, creating an integrated structure where the metal trace pattern is formed directly on the flexible substrate. This merging of layers simplifies the overall device structure and manufacturing process compared to assembling separate components, while maintaining structural integrity and reliability.

Inventive Principle:
Principle #5Merging (Combining)

4Manufacturing precision

If laser ablation is used to form holes and patterns, then manufacturing precision is improved, but the complexity of the manufacturing process is worsened

Engineering Contradiction:
Improvemanufacturing precisionVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent employs laser ablation technology to form precise holes, slots, and patterns in the metal layer and polymer substrate. This replaces traditional mechanical cutting or drilling methods with a non-contact, highly precise laser-based process. While laser equipment adds complexity to the manufacturing setup, it dramatically improves manufacturing precision and can be automated, ultimately simplifying the overall manufacturing workflow through consistent, repeatable results.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the creation of durable, flexible electrodes that maintain structural integrity and facilitate effective neural stimulation and recording, reducing the risk of tissue damage and improving handling and longevity.

Implementation Method 1

laser ablation is used to cut the metal layer and form the first and second sets of holes

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

the metal layer is cleaned with oxygen plasma before laminating the first silicone layer to the second silicone layer

Methodology Applied
Scientific EffectOxygen plasma: Plasma

Implementation Method 3

A first silicone layer is formed by knife-coating a polymer mesh with silicone and cured

Methodology Applied
Scientific EffectCuring: Photopolymerisation

Implementation Method 4

Wires are welded to the exposed contact pads

Methodology Applied
Scientific EffectWelding: Welding

Data Source

PatentUS11938314B2Method of manufacturing an implantable neural electrode interface platform
Publication Date: 2024.03.26 THE CHARLES STARK DRAPER LABORATORY INC
  • US11938314B2 patent drawing
  • US11938314B2 patent drawing
  • US11938314B2 patent drawing

AI summary

The present disclosure discusses a method of manufacturing an implantable neural electrode. The method includes cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces connecting the electrode sites to the contact pads. A first silicone layer including a mesh is formed and coupled to the metal layer. A second silicone layer is formed and laminated to the first silicone layer coupled with the metal layer. Holes are formed in the first or second silicone layer exposing the contact pads and electrode sites. Wires are welded to the exposed contact pads and a third layer of silicone is overmolded over the contact pads and wires.