Neural Microprobe with Segmented Insulation for Noise Reduction

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Solution Overview

Problem

Conventional neural sensing devices are affected by noise from the stratum corneum layer of the skin due to the penetration of microprobes, which interferes with the collection of bio-electrical signals from the stratum germinativum layer.

Innovation Solution

A neural sensing device with microprobes that have conductive vias electrically isolated from each other, surrounded by circular insulation material, and tipped with platinum, which penetrate through the stratum germinativum layer to collect signals while being insulated from the stratum corneum layer, reducing noise interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If microprobes are used to penetrate the skin to collect bio-electrical signals, then signal collection capability is improved, but noise interference from the stratum corneum layer increases

Engineering Contradiction:
Improvebio-electrical signal collectionVSAvoidnoise interference
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The microprobe is segmented into distinct functional zones: a noise-isolating portion in the stratum corneum layer and a signal-collecting portion in the stratum germinativum layer. This segmentation allows the probe to simultaneously achieve noise reduction and effective signal collection by separating the functions of different sections along the probe length.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the microprobe are赋予 different properties: the upper portion (in stratum corneum) has noise-isolating characteristics, while the lower portion (in stratum germinativum) has signal-collecting characteristics. This local differentiation of properties enables the probe to address both noise reduction and signal acquisition requirements in different locations.

Inventive Principle:
Principle #3Local quality

2Measurement precision

If microprobes penetrate through the stratum corneum layer to reach the stratum germinativum layer, then signal collection effectiveness is improved, but susceptibility to noise from the stratum corneum layer worsens

Engineering Contradiction:
Improvesignal collection effectivenessVSAvoidnoise susceptibility
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The microprobe structure acts as an intermediary element that mediates between the noisy stratum corneum layer and the signal-rich stratum germinativum layer. By positioning the signal-collecting portion deep in the germinativum layer while maintaining structural presence in the corneum layer, the probe mediates signal extraction while filtering out noise from the intermediate corneum layer.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The solution moves the signal collection function to a different spatial dimension (depth) within the skin layers. By extending the microprobe vertically through the stratum corneum to reach the stratum germinativum, the design exploits the dimensional separation between layers to achieve noise isolation while maintaining signal collection capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If conventional microprobes are used without insulation, then manufacturing simplicity is maintained, but noise interference from skin layers increases

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidnoise interference
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

A thin insulating film is applied to the microprobe structure to electrically isolate the conductive elements from the noisy stratum corneum layer. This thin film insulation provides effective noise reduction while maintaining the overall simplicity of the probe structure and manufacturing process.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device effectively collects bio-signals with high resolution and minimizes noise interference by isolating the microprobes from the stratum corneum layer, allowing for accurate detection of physiological signals such as EEG, ECoG, Neural Spike, ECG, EMG, and EOG.

Implementation Method 1

Each of the conductive vias penetrates through the base and the respective microprobe, extending from the active surface of the base to a tip of the microprobe. The conductive vias are electrically connected to the integrated circuit portion.

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

When the stratum germinativum layer is penetrated, the microprobes are electrically insulated from the stratum corneum layer of the skin by the isolation layer, thus reducing noise.

Methodology Applied
Scientific EffectElectrical insulation: Electrical Resistance

Implementation Method 3

a circular insulation material surrounds conductive metal of each of the conductive vias

Methodology Applied
Scientific EffectElectrical insulation: Electrical Resistance

Data Source

PatentUS9089268B2Neural sensing device and method for making the same
Publication Date: 2015.07.28 ADVANCED SEMICON ENG INC
  • US9089268B2 patent drawing
  • US9089268B2 patent drawing
  • US9089268B2 patent drawing

AI summary

The present invention provides a neural sensing device and method for making the same. The neural sensing device includes a base, an integrated circuit portion and a plurality of microprobes. The base has an active surface and a backside surface. The integrated circuit portion is disposed on the active surface of the base. The microprobes protrude from the backside surface of the base. The conductive vias are disposed in the microprobes and electrically connected to the integrated circuit portion.