Neural Probe Thin Film Lead Interposer Design
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Solution Overview
Problem
Current neurostimulation and neurorecording systems face challenges with the connection between thin film leads and Advanced Lead Connector elements, including limited pin density, fragility of thin films, and high production costs, which affect reliability and safety.
Innovation Solution
A probe with a thin film lead and Advanced Lead Connector element, where the connection is improved using an interposing means such as a flexible printed circuit board with metal tracks, allowing for a smaller footprint and better mechanical properties, facilitating a reliable and efficient electronic connection between the thin film electrodes and the connector.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large area is allocated for connection to ceramic feed-through pins, then the connection reliability between thin film and connector is improved, but the thin film area becomes expensive and difficult to allocate in wafer-based manufacturing
Solution Approach 1:
The patent introduces an interposing means (flexible printed circuit board with metal tracks) as an intermediary component between the thin film lead and the Advanced Lead Connector. This mediator enables reliable electrical connection without requiring a large thin film area, thus resolving the contradiction between connection reliability and manufacturing ease. The interposer handles the mechanical and electrical interface functions that would otherwise require extensive thin film real estate.
Solution Approach 2:
The patent segments the connection system into three distinct components: the thin film lead with electrodes, the interposing means (FPCB with metal tracks), and the Advanced Lead Connector with ceramic feed-through. By dividing the connection function across these separate elements, the system achieves reliable connections without requiring the thin film to directly interface with the connector, thereby reducing the required thin film area and associated manufacturing costs.
2Device complexity
If standard flex foil with electronic circuitry is used for connection, then the electrical interface is simplified, but the electronics are exposed to body fluids which compromises reliability for chronic use
Solution Approach 1:
The interposing means acts as a mediator that separates the non-hermetic flexible circuit from the hermetically sealed connector housing. The FPCB with metal tracks provides the necessary electrical interfacing function while being contained within or connected to the hermetic package, thus maintaining both electrical simplicity and hermetic sealing for chronic implantable use.
3Reliability
If ceramic feed-through with brazed through-hole pin connectors is used, then hermetic sealing is achieved, but the pin density per unit area is limited which increases the required connection area
Solution Approach 1:
The interposing means serves as a mediator that decouples the hermetic sealing function from the electrical connection area requirement. The FPCB with metal tracks can achieve high pin density in a compact area, interfacing with the ceramic feed-through pins without requiring a large connection footprint on the thin film side.
4Ease of manufacture
If the thin film area is reduced to lower costs, then manufacturing cost is decreased, but the connection area to feed-through becomes insufficient
Solution Approach 1:
The interposing means enables the thin film area to be minimized for cost reduction while maintaining adequate connection capability. The FPCB with metal tracks provides the necessary electrical pathways and connection interface, allowing the thin film to be smaller than what would be required for direct connector attachment.
Data Source
AI summary
The present invention relates to a probe comprising at least one lead and an Advanced Lead Connector (ALC) element, the lead comprising at least one thin film, whereby the thin film comprises a proximal end and a distal end, the lead further comprising a plurality of electrodes on the distal end of the thin film, the ALC element comprising electronic means to address the plurality of electrodes and at least one ALC connecting means, whereby the proximal end of the thin film and the ALC connecting means are connected by an interposing means so as to form at least an electric and/or electronic connection between the electrodes and the ALC element. Furthermore, the present invention relates to a neurostimulation and/or neurorecording system, an interposing means, an assembly comprising at least one thin film for a lead of a probe and an ALC element and a method of manufacturing a probe.