Neural Probe Optical Waveguide Manufacturing via Photosensitive Adhesive
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Solution Overview
Problem
Existing neural probes face challenges with biologically-compatible optical fibers and waveguides, which often require complex and costly manufacturing processes, leading to increased size and limited scope of neural action information.
Innovation Solution
A neural probe incorporating an optical waveguide directly formed on a substrate with electrode parts, using a rapid manufacturing method involving a mold-filling step with a photosensitive adhesive, which is solidified to form the optical waveguide, allowing for various shapes and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If an optical fiber is used as the light source, then the neural probe can be implanted into specific zones to control specific genes, but the optical fiber has large size and cannot be minimized
Solution Approach 1:
The patent segments the optical waveguide into multiple layers (first waveguide layer, second waveguide layer) that can be formed separately and then integrated. This segmentation allows each layer to be optimized independently for minimal size while maintaining the overall functionality for controlling specific genes in neural tissue.
Solution Approach 2:
The patent implements nesting by placing the first optical waveguide layer within or adjacent to the second optical waveguide layer, creating a compact nested structure. This nested arrangement minimizes the overall size of the optical component while preserving the ability to deliver light for gene control in neural zones.
2Adaptability or versatility
If an optical waveguide is manufactured using semiconductor process, then various types of optical waveguides can be manufactured, but the process is complicated, time-consuming, labor-consuming and expensive
Solution Approach 1:
The patent changes the manufacturing parameters from complex semiconductor processes to a simpler method involving photosensitive adhesive and UV irradiation. By changing the material state (from solid semiconductor wafers to liquid photosensitive adhesive) and the curing method (from high-temperature processing to UV light irradiation), the manufacturing process becomes less complex, faster, and more cost-effective while still producing functional optical waveguides.
Solution Approach 2:
The patent replaces the mechanical and thermal processing of semiconductor manufacturing with a photochemical process. Instead of using mechanical cutting, high-temperature firing, and complex lithography, the invention uses UV light irradiation to cure photosensitive adhesive into functional optical waveguide structures, substituting a simpler optical-chemical process for complex mechanical-manufacturing processes.
3Stability of the object's composition
If adhesive material is applied to fill space between optical fiber and neural probe, then the space is filled, but the whole thickness increases
Solution Approach 1:
The patent merges the bonding function and the optical waveguide function into a single integrated structure. The photosensitive adhesive serves dual purposes: it bonds the optical waveguide to the neural probe substrate and simultaneously forms the optical waveguide itself when cured. This eliminates the need for separate adhesive layers, thereby minimizing the overall thickness while maintaining stable bonding.
Solution Approach 2:
The photosensitive adhesive material performs multiple functions: it acts as the bonding agent to attach the optical waveguide to the substrate, serves as the optical waveguide medium itself for light transmission, and provides structural support. This multi-functionality eliminates the need for separate components, reducing overall thickness while ensuring stable composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables rapid production of neural probes with minimized size, reducing the wound size on living bodies and decreasing the overall loading, while enhancing functionality and cost-effectiveness.
Implementation Method 1
a solidification process for solidifying the photosensitive adhesive by UV irradiation, the solidified photosensitive adhesive forming the optical waveguide
Data Source
AI summary
The present invention provides a method for manufacturing a neural probe incorporated with an optical waveguide. The method for manufacturing a neural probe incorporated with an optical waveguide comprises the following steps. A mold-filling step, for providing a base with at least one groove formed therein. A disposing step, for disposing and overlaying a substrate having a plurality of electrode parts on the groove of the base. A combining step, for solidifying the photosensitive adhesive by a solidification process, the solidified photosensitive adhesive forming an optical waveguide and being combined with the substrate. A mold-releasing step, for removing the base from the optical waveguide and the substrate, the substrate and the optical waveguide forming a product.