Neural Probe Electrode Contacts via PVD for Flexible Circuits
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Solution Overview
Problem
Existing methods for manufacturing neural probes with non-corrosive metals like iridium, platinum, and their oxides are inefficient and costly, and traditional welding processes are not suitable for incorporating flexible circuit components.
Innovation Solution
A physical vapor deposition process is used to attach non-corrosive metals such as platinum, iridium, and their oxides to the elongate connectors of neural probes, combined with welding techniques like ultrasonic or resistance welding, to create electrode contacts that are thin, flexible, and have suitable contact surface resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional welding processes are used to attach electrode contacts to connectors, then strong mechanical bonding is achieved, but the process is not suitable for flexible circuit components and increases manufacturing complexity
Solution Approach 1:
The patent replaces traditional mechanical welding processes with a deposition-based manufacturing approach. Instead of using welding to attach electrode contacts to flexible circuit connectors, the invention uses deposition methods to directly form conductive traces and contact structures on the flexible substrate, eliminating the need for separate welding operations and making the process suitable for flexible circuit components.
2Reliability
If non-corrosive metals like iridium and platinum are incorporated into flex circuit neural probes, then corrosion resistance and biocompatibility are improved, but manufacturing efficiency decreases and costs increase
Solution Approach 1:
The patent merges the functions of multiple manufacturing steps into a single deposition process. By forming both the conductive traces and electrode contacts in one integrated deposition operation, the invention eliminates separate steps for trace formation and contact attachment, thereby improving manufacturing efficiency while maintaining the use of non-corrosive metals.
Solution Approach 2:
The invention changes the manufacturing parameters by using deposition techniques with controlled material thickness and composition. By adjusting deposition parameters such as layer thickness, material composition, and deposition rate, the process achieves both high manufacturing efficiency and reliable incorporation of non-corrosive metals like iridium and platinum.
3Reliability
If thicker electrode contacts are used to ensure adequate contact surface resistance, then electrical performance is improved, but probe flexibility and deliverability are reduced
Solution Approach 1:
The patent employs composite material structures with multiple layers of different conductive materials. By stacking layers such as tungsten, iridium, and platinum in specific configurations, the invention achieves adequate contact surface resistance and electrical performance while maintaining thin overall dimensions and probe flexibility.
Solution Approach 2:
Instead of increasing contact thickness in the vertical dimension, the invention compensates by optimizing the lateral dimensions and surface area of the electrode contacts. The deposition process allows for precise control of contact geometry in multiple dimensions, achieving required electrical performance without increasing probe thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process results in neural probes with electrode contacts that are more efficient, cost-effective, and flexible, allowing for improved manufacturing of thin film probes with enhanced deliverability and reduced thickness.
Implementation Method 1
A physical vapor deposition process is used to attach non-corrosive metals such as platinum, iridium, and their oxides to the elongate connectors of neural probes
Implementation Method 2
combined with welding techniques like ultrasonic or resistance welding
Implementation Method 3
combined with welding techniques like ultrasonic or resistance welding
Data Source
Figure 1A~1C
Figure 2A~2C
Figure 3A~3D
AI summary
Various methods for making probe devices that include the addition of electrode contact material using various different processes and/or techniques, along with the resulting devices. Some methods include adding electrode contact material such that the resulting electrode contacts are suitable for direct contact with patient tissue while encapsulating materials that are not.