Neutron-Absorbing Semiconductor Packaging for Cosmic Radiation Protection
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Solution Overview
Problem
Semiconductor devices are susceptible to damage from cosmic radiation, particularly secondary cosmic radiation particles, which cause performance degradation and permanent structural damage as their size shrinks, leading to increased performance divergence between manufacturing and integration into electronic devices.
Innovation Solution
Incorporation of radiation shields in semiconductor devices using neutron-absorbing materials such as hydrocarbons, boron, lithium, gadolinium, and cadmium to absorb and decelerate neutrons, including layers of neutron-shielding films, lids, and coatings to protect the electrical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor device size is reduced to increase capacity and performance density, then device capacity and speed increase, but susceptibility to radiation damage increases
Solution Approach 1:
The patent introduces a radiation shield as an intermediary component between the semiconductor die and the external environment. This shield, made of neutron-absorbing materials, mediates the interaction between cosmic radiation and the semiconductor components, absorbing neutron radiation before it can reach and damage the sensitive electronic components.
Solution Approach 2:
The radiation shield is integrated into the semiconductor package structure beforehand, providing protective cushioning against radiation damage before the semiconductor device is deployed. The shield is positioned to intercept neutron radiation in advance, preventing the radiation from reaching the semiconductor die and causing damage.
2Area of stationary object
If multiple semiconductor dies are stacked vertically to increase capacity within limited area, then device capacity increases, but susceptibility to radiation damage increases
Solution Approach 1:
The patent implements a nested structure where multiple semiconductor dies are stacked vertically within a compact package, and the radiation shield is integrated into this nested arrangement. The shield encompasses the stacked dies, providing protection while maintaining the space-efficient vertical configuration.
Solution Approach 2:
The radiation shield is constructed from composite materials with neutron-absorbing properties, combining multiple materials to achieve optimal radiation protection. This allows the shield to provide comprehensive protection against neutron radiation while maintaining a compact form factor suitable for stacked device configurations.
3Reliability
If radiation shields are added to protect semiconductor components from cosmic radiation, then radiation protection improves, but device complexity increases
Solution Approach 1:
The radiation shield is designed to serve multiple functions: it provides neutron radiation protection, structural support for the stacked dies, and thermal management assistance. By integrating these functions into a single component, the overall device complexity is reduced compared to having separate elements for each function.
Solution Approach 2:
The patent merges the radiation shielding function with the package structure itself, rather than adding it as a separate external component. The shield is integrated into the package substrate or interlayer structure, combining protection and structural support into a unified design that minimizes additional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The radiation shields effectively absorb and decelerate neutrons, reducing performance degradation and structural damage from cosmic radiation, thereby maintaining consistent device performance across various environments and over time.
Implementation Method 1
Incorporation of radiation shields in semiconductor devices using neutron-absorbing materials such as hydrocarbons, boron, lithium, gadolinium, and cadmium to absorb and decelerate neutrons
Data Source
AI summary
Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor devices include a package substrate, a stack of dies carried by the package substrate, and one or more radiation shields configured to absorb neutrons from neutron radiation incident on the semiconductor device. The radiation shields can include one or more walls attached to a perimeter portion of the package substrate at least partially surrounding the stack of dies and/or a lid carried over the stack of dies. Each of the radiation shields can include hydrocarbon materials, boron, lithium, gadolinium, cadmium, and like materials that effectively absorb neutrons from neutron radiation. In some embodiments, the semiconductor devices also include a molding material over the stack of dies and the radiation shields, and a hydrocarbon coating over an external surface of the mold material.