Co-located NFC Reader PCB Design with Gap Isolation

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Solution Overview

Problem

The integration of a near-field communications (NFC) reader into electronic devices, such as keypads and touchscreens, is hindered by the size constraints and interference from metal components in printed circuit boards (PCBs), leading to increased device size and cost due to the need for separate NFC chipsets and insulation using ferrite.

Innovation Solution

A multilayer PCB design with inner and outer sections separated by gaps, where the NFC antenna is routed between these sections at a right angle, allowing for a co-located NFC reader without direct contact with the PCB, thus avoiding interference and reducing costs by eliminating the need for separate NFC chipsets and insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the NFC antenna is placed on the PCB, then the NFC reader can be integrated into the electronic device, but the metal components in the PCB cause interference with the NFC antenna

Engineering Contradiction:
ImproveNFC reader integrationVSAvoidmetal interference
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The PCB is divided into two separate sections: an inner section for electronic device circuits and an outer section for the NFC chipset, separated by a gap. This segmentation prevents metal interference from the inner section from affecting the NFC antenna while maintaining integration on a single PCB.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A bridge structure with traces is introduced as an intermediary to connect the inner and outer PCB sections. The bridge is positioned to avoid interfering with the NFC antenna while providing electrical connection between the separated sections.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the NFC chipset is placed on a separate PCB, then interference from metal components is avoided, but the device size increases

Engineering Contradiction:
Improvemetal interferenceVSAvoiddevice size
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The inner PCB section (for electronic device circuits) and outer PCB section (for NFC chipset) are merged into a single PCB structure with a gap between them. This combining approach maintains the interference isolation benefits of separate PCBs while keeping the overall device size compact.

Inventive Principle:
Principle #5Merging (Combining)

3Object-affected harmful factors

If ferrite is used to insulate the NFC antenna, then interference is reduced, but the device cost increases

Engineering Contradiction:
ImproveinterferenceVSAvoiddevice cost
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The gap between the inner and outer PCB sections serves to extract and eliminate the need for additional ferrite insulation materials. The structural separation itself provides the necessary interference isolation, removing the need for extra insulating components and reducing device cost.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables a compact, cost-effective integration of NFC readers with electronic devices, enhancing communication capabilities while minimizing physical and financial overhead.

Implementation Method 1

A near field communications (NFC) reader may use a loop antenna

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentEP3101817B1Printed circuit board design for for co-located NFC reader
Publication Date: 2018.01.17 GOOGLE LLC
  • EP3101817B1 patent drawingFigure 1
  • EP3101817B1 patent drawingFigure 2
  • EP3101817B1 patent drawingFigure 3

AI summary

Systems and techniques are provided for a co-located NFC reader. A top conductive layer may include an inner PCB section, including a circuit for an electronic device, and an outer PCB section, including a near-field communications (NFC) chipset, separated by a gap in which an NFC antenna connected to the NFC chipset may be located. A substrate layer may include an inner PCB section and an outer PCB section separated by the gap. A bridge including a trace may cross the gap. A lower conductive layer may include an inner PCB section, including a circuit for the electronic device electrically connected to the circuit for the electronic device located on the inner PCB section of the top conductive layer, and an outer PCB section, including a circuit for the electronic device, separated by the gap.