NFC Tag Antenna Segmentation Reduces Copper Volume
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Solution Overview
Problem
The existing assembly process for NFC chip, sensor, and antenna integrated circuits is costly and time-consuming due to the large size of the final circuit, which requires a significant amount of copper for the antenna and sensor.
Innovation Solution
The method involves separating the active components (NFC chip and sensor) from the antenna, allowing for a minimized surface area and reduced production costs. This is achieved by providing an intermediate circuit with the NFC chip and sensor connected, and a single side inlay with a substrate and antenna, which are then mated together.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the NFC chip, sensor, and antenna are produced on a single integrated circuit with large dimensions, then the circuit can be assembled in one piece, but the amount of copper required increases and production costs become expensive and time-consuming
Solution Approach 1:
The patent divides the integrated circuit into two separate components: an intermediate circuit containing the NFC chip and sensor, and a separate inlay containing the antenna. This segmentation allows each component to be optimized independently and assembled separately, reducing the overall copper requirement while maintaining functionality.
Solution Approach 2:
The antenna is extracted from the traditional single-circuit design and placed on a separate inlay. This extraction removes the need for extensive copper traces connecting the antenna to the NFC chip and sensor, significantly reducing the total copper amount required in the system.
2Productivity
If the NFC chip, sensor, and antenna are produced on a single integrated circuit, then the circuit structure is unified, but the assembly process becomes expensive and time-consuming
Solution Approach 1:
By segmenting the circuit into an intermediate circuit and a separate inlay, the patent enables parallel production of components and simplifies the final assembly process. The intermediate circuit can be manufactured using standard PCB processes while the inlay can be produced separately, then quickly assembled together, improving overall production speed and reducing costs.
Solution Approach 2:
The patent merges the intermediate circuit and inlay through a simplified assembly process where the inlay is placed over the intermediate circuit and electrically connected. This merging approach is more efficient than traditional single-circuit manufacturing, reducing both time and cost while maintaining circuit integrity.
3Quantity of substance
If the antenna and sensor are minimized in surface area, then production costs are optimized, but the circuit layout becomes more complex
Solution Approach 1:
The segmentation of the antenna onto a separate inlay allows it to be minimized in surface area without complicating the intermediate circuit layout. The antenna can be optimized for its specific function on the inlay while the intermediate circuit maintains a simpler, more straightforward layout for the NFC chip and sensor connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production time and costs by minimizing the amount of copper used and allowing for a more efficient assembly process, including the use of a reel-to-reel process for mass production.
Implementation Method 1
the electro-magnetic field generated by the external reader is retrieved by the antenna on the single sided inlay and is then converted in power by the NFC chip
Data Source
AI summary
The present invention refers to a method for producing an integrated circuit comprising a Near Field Communication (NFC) chip, a sensor and an antenna, wherein the method comprises the steps of providing an intermediate circuit comprising the NFC chip connected the sensor, for instance a biosensor, and of providing a single side inlay comprising a substrate and the antenna. Afterwards, the intermediate circuit and the single side inlay are mated together so as to connect the NFC chip to the antenna. The present invention also refers to the integrated circuit or tag produced according to this method.