Ni-Cu Internal Electrodes Prevent Delamination in MLCCs
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Solution Overview
Problem
Miniaturized and high-capacity multilayer ceramic capacitors face issues with electrolytic cracking and degraded waterproof reliability due to delamination between internal electrodes and dielectric layers, which affects sinterability and capacitance per unit volume.
Innovation Solution
A method involving the use of nickel (Ni) powder with a copper (Cu) coating layer, where the Cu content is equal to or greater than 0.2 wt % based on the total weight of the Ni powder, is used to form internal electrodes, preventing delamination and enhancing plating anticorrosion and electrolytic delamination characteristics without sinterability deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the internal electrode is thinned to achieve miniaturization and high capacity, then the capacitance per unit volume increases, but electrolytic cracking occurs and waterproof reliability is degraded due to delamination between the internal electrode and dielectric layer
Solution Approach 1:
The patent changes the chemical composition parameters of the internal electrode by incorporating copper powder at a specific content range (0.1-5 wt% based on total internal electrode weight) into the nickel-based paste. This parameter modification alters the electrode's properties to prevent delamination and electrolytic cracking while maintaining thin electrode thickness for high capacitance per unit volume.
Solution Approach 2:
The patent creates a composite internal electrode material by combining nickel powder (providing basic conductivity and structure) with copper powder (providing enhanced adhesion and corrosion resistance). This composite structure leverages the complementary properties of both metals to simultaneously achieve miniaturization and maintain waterproof reliability.
2Quantity of substance
If the internal electrode is thinned to increase stacking number and maximize area, then high capacity is achieved, but sinterability deteriorates
Solution Approach 1:
The patent modifies the paste composition parameters by adding copper powder with specific particle characteristics and content range. This changes the sintering behavior and adhesion properties of the thin internal electrode, enabling successful sintering and forming of high-capacity miniaturized capacitors without compromising manufacturing feasibility.
3Ease of manufacture
If conventional internal electrode materials are used, then manufacturing is simple, but delamination occurs between the internal electrode and dielectric layer leading to electrolytic cracking
Solution Approach 1:
The patent develops a composite internal electrode paste containing both nickel powder and copper powder in specific proportions. This composite formulation maintains relatively simple manufacturing processes while significantly improving resistance to electrolytic cracking and delamination through the synergistic effects of the two metals.
Solution Approach 2:
The patent optimizes the chemical composition parameters of the internal electrode paste by incorporating copper powder at 0.1-5 wt%. This parameter change enhances the electrode's resistance to electrolytic cracking and delamination while maintaining compatibility with existing manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach effectively prevents electrolytic cracking and enhances waterproof reliability, allowing for the creation of miniaturized and high-capacity multilayer ceramic capacitors with improved performance and reliability.
Implementation Method 1
a main cause of such cracking is delamination between an internal electrode and a dielectric layer... preventing electrolytic cracking from occurring
Implementation Method 2
forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure
Data Source
AI summary
A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.