Ni Plating Layer Geometry for Ceramic Electronic Component Stress
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Solution Overview
Problem
Monolithic ceramic electronic components face challenges in resisting shock and thermal stress, leading to cracking, despite the use of resin-containing electrode layers, as the stress is concentrated through the Ni plating layers, causing cracks and solder leaching.
Innovation Solution
A ceramic electronic component with a resin-containing electrode layer and a Ni plating layer, where the Ni plating layer's thickness (t1) and contact extension (t2) ratio (t2/t1) is controlled to be less than 1, reducing shearing stress concentration and preventing crack formation, and further optimized to be greater than 0.06 to prevent solder leaching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a Ni plating layer is formed on the resin-containing electrode layer, then solderability and electrical conductivity are improved, but shearing stress concentration occurs at the interface with the ceramic body, causing cracks
Solution Approach 1:
The invention changes the geometric parameters of the Ni plating layer by controlling the ratio t2/t1 (where t2 is the contact extension distance and t1 is the plating layer thickness). By optimizing this ratio to be less than 1, the design reduces stress concentration while maintaining solderability, resolving the contradiction between electrical conductivity and mechanical strength.
2Reliability
If the Ni plating layer extends far onto the ceramic body (large t2), then electrical connection is improved, but stress concentration increases causing crack formation
Solution Approach 1:
The invention optimizes the geometric parameters of the Ni plating layer configuration. Specifically, it controls the ratio t2/t1 to balance electrical connection needs against stress concentration risks, preventing crack formation while maintaining adequate electrical conductivity.
3Strength
If the Ni plating layer is thin (small t1), then stress concentration is reduced, but solderability deteriorates
Solution Approach 1:
The invention simultaneously optimizes two parameters: the plating layer thickness t1 and the contact extension distance t2. By controlling their ratio t2/t1 to be less than 1, the design achieves adequate solderability with a thin plating layer while the limited contact extension reduces stress concentration on the ceramic body.
4Strength
If the ceramic body is made more robust to resist stress, then crack resistance is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention extracts the stress-bearing function from the ceramic body by introducing a dedicated buffer structure (the optimized Ni plating layer with limited contact extension). This allows the ceramic body to maintain its original simple structure while the plating layer configuration absorbs mechanical stress, preventing cracks without increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces crack formation and solder leaching, enhancing the component's durability and reliability under mechanical and thermal stress.
Implementation Method 1
the Ni plating layer's thickness (t1) and contact extension (t2) ratio (t2/t1) is controlled to be less than 1, reducing shearing stress concentration and preventing crack formation
Implementation Method 2
the resin-containing electrode layer buffers external stress applied to a ceramic body
Data Source
AI summary
A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.