Nickel Interconnect Electrodeposition Without Boric Acid
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Solution Overview
Problem
Existing copper interconnects in 3D ICs face reliability issues due to oxidation, thermal expansion mismatch, intermetallic compound formation, and internal stress, necessitating a more reliable and stable metal alternative that does not use boric acid in electrodeposition chemistries.
Innovation Solution
A nickel electrodeposition composition is developed, including nickel ions, polarizing and depolarizing additives, surfactants, and stress modifiers, which allows for via fill metallization without boric acid, enhancing reliability and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If boric acid is used in nickel electrodeposition chemistries, then deposition process is simplified, but toxicity increases
Solution Approach 1:
The patent extracts and removes boric acid from the nickel electrodeposition chemistry formulation. By eliminating this toxic component while retaining essential deposition functionality through alternative additives and process parameters, the patent achieves both simplified manufacturing and reduced toxicity.
Solution Approach 2:
The patent replaces the toxic boric acid with alternative, less hazardous chemicals that can be easily disposed of or degraded. The alternative chemistry uses environmentally friendlier substances that maintain deposition effectiveness without the long-term toxicity concerns of boric acid.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The nickel electrodeposition process improves interconnect reliability by reducing oxidation, cracking, and internal stress, while avoiding the toxicity concerns associated with boric acid.
Implementation Method 1
A nickel electrodeposition composition is developed, including nickel ions, polarizing and depolarizing additives, surfactants, and stress modifiers, which allows for via fill metallization without boric acid
Data Source
AI summary
A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and/or stress modifiers to produce bottom-up filling of vias and trenches.