Nickel Oxide Barrier Coating for Fluorine-Resistant Chamber Components
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Solution Overview
Problem
Semiconductor processing chamber components face issues with metal fluoride and oxyfluoride formation due to interactions with fluorine-based plasmas, leading to contamination layers that reduce chamber lifetime and cause substrate defects.
Innovation Solution
A nickel-containing metal layer with a nickel oxide barrier layer formed via ozone treatment is applied to chamber components to protect against fluorine-based attacks, enhancing the chamber's lifespan and reducing particle contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electroless nickel plated (ENP) surface is used on chamber components, then particle contamination and metal fluoride formation are reduced, but the component lifetime decreases and oxyfluoride-containing contamination layers form at temperatures of 150°C or above
Solution Approach 1:
The patent applies a composite coating structure consisting of an electroless nickel plated (ENP) layer combined with an aluminum-containing top layer. This composite structure provides both the particle contamination resistance of nickel plating and the enhanced thermal stability and lifetime of aluminum-based materials, preventing oxyfluoride formation at elevated temperatures while maintaining erosion resistance
Solution Approach 2:
The patent modifies the surface composition parameters by incorporating aluminum-containing materials into the coating system. This parameter change transforms the coating from pure nickel (which forms oxyfluorides at 150°C+) to an aluminum-modified composite that maintains stability at higher temperatures, thereby extending component lifetime without sacrificing contamination protection
2Productivity
If chamber components are exposed to fluorine-based plasma and corrosive gases, then semiconductor manufacturing processes can be performed, but metal fluorides and oxyfluorides form leading to contamination and reduced component lifetime
Solution Approach 1:
The aluminum-containing top layer creates a chemically inert surface environment that resists reaction with fluorine-based plasmas and corrosive gases. This inert barrier prevents the formation of metal fluorides and oxyfluorides, maintaining component reliability while allowing continuous semiconductor manufacturing operations
Solution Approach 2:
The dual-layer composite coating (ENP base layer + aluminum-containing top layer) provides both the mechanical properties needed for manufacturing operations and the chemical resistance required to prevent metal fluoride formation, thereby maintaining both productivity and reliability simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The nickel oxide barrier layer significantly increases the serviceable lifetime of chamber components by up to ten times, reducing preventative maintenance needs and minimizing particle contamination.
Implementation Method 1
performing an ozone treatment on the metal plating to form a barrier layer on the metal plating, wherein the barrier layer may include nickel oxide
Data Source
AI summary
Described herein is a chamber component including a metal layer comprising nickel and a barrier layer of nickel oxide over the metal layer. The barrier layer of nickel oxide may be formed by ozone treating the chamber component with air, nitrogen or argon O2, O3 at a temperature from about 25° C. to about 350° C.