Nickel-Palladium Alloy Layer for Crack-Resistant Electronic Device Metallization
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Solution Overview
Problem
There is a need for a simply constructed connection device with high performance and ease of production, particularly in electronic components like integrated circuits, that can withstand mechanical stress and provide reliable electrical connections without damaging the underlying metallization or dielectrics.
Innovation Solution
The use of a nickel-palladium alloy as a protective layer in electronic devices, applied through electrochemical deposition or sputtering, which offers high mechanical resistance, is crack-free, and can be used for both aluminum and copper metallization, enabling reliable wire bonding and soldering while preventing damage from needle card testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective layer is applied to provide mechanical resistance and prevent cracking, then the device reliability improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies a composite protective layer structure consisting of multiple materials (e.g., nickel-palladium alloy, nickel-gold alloy, or copper-gold alloy) deposited in specific sequences. This composite structure provides enhanced mechanical resistance and crack prevention while maintaining compatibility with underlying metallization layers, thus improving reliability without excessive complexity
Solution Approach 2:
The patent specifies precise parameter ranges for the protective layer including thickness (0.5-3 micrometers), material composition ratios, and deposition conditions. By optimizing these parameters, the protective layer achieves maximum mechanical resistance and crack resistance while controlling manufacturing complexity through standardized specifications
2Reliability
If a protective layer is applied to prevent damage from needle card testing, then the reliability improves, but the manufacturing process becomes more complex
Solution Approach 1:
The protective layer is deposited in advance before needle card testing and other mechanical stress events occur. This preliminary protective action prevents damage during subsequent manufacturing and testing processes, ensuring reliability without requiring complex post-processing steps
Solution Approach 2:
The protective layer serves multiple functions simultaneously: it provides mechanical resistance during needle card testing, prevents cracking during wire bonding and soldering, protects underlying metallization, and enables compatibility with various bonding materials. This multi-functionality reduces the need for additional specialized protective measures
3Reliability
If a nickel-palladium alloy layer is used to provide mechanical resistance and prevent cracking, then the reliability improves, but the manufacturing precision requirements increase
Solution Approach 1:
The patent defines specific parameter ranges for the nickel-palladium alloy layer including thickness (0.5-3 micrometers), palladium content ratios, and deposition conditions. These parameter specifications enable consistent manufacturing of the protective layer with reliable crack resistance while providing clear guidance for production control
Solution Approach 2:
The patent employs composite alloy compositions (nickel-palladium, nickel-gold, or copper-gold) with specific material properties that inherently provide crack resistance. The material composition itself is designed to accommodate manufacturing variations while maintaining protective functionality, reducing the stringency of precision requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The nickel-palladium layer provides enhanced mechanical resistance, prevents cracking, and ensures reliable electrical connections, allowing for improved adhesion of molding compounds and increased housing reliability, while being compatible with various wire bonding and soldering materials.
Implementation Method 1
A second conductive material, containing a nickel-palladium alloy, is applied on the first conductive material
Implementation Method 2
applied through electrochemical deposition or sputtering
Data Source
AI summary
An electronic device and the production thereof is disclosed. One embodiment includes an integrated component having a layer containing a nickel-palladium alloy.