Nickel Termination Pad Clad-Bonded to Titanium Base Layer
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Solution Overview
Problem
Nickel termination-pads do not form strong, reliable connections with titanium casings in implantable medical devices due to brittleness caused by intermetallic formation, which is undesirable for robust and long-lasting welds.
Innovation Solution
A nickel termination-pad is clad-bonded to a titanium base layer, ensuring robust and conductive connections by welding similar metals, thereby avoiding intermetallic formation and maintaining structural integrity and electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a nickel termination-pad is directly welded to a titanium casing, then electrical conductivity is achieved, but the weld strength deteriorates due to intermetallic formation and brittleness
Solution Approach 1:
The invention uses a composite structure consisting of a titanium base layer clad-bonded to a nickel termination pad layer. This composite material approach allows the titanium base layer to provide strong, ductile weldability to the titanium casing, while the nickel termination pad layer provides the required electrical conductivity and connection interface for device electronics, thereby resolving the contradiction between weld strength and electrical conductivity
Solution Approach 2:
The titanium base layer acts as an intermediary between the nickel termination pad and the titanium casing. By introducing this intermediate titanium layer, the direct nickel-to-titanium weld that causes intermetallic formation is avoided. Instead, the titanium base layer bonds to both the nickel termination pad and the titanium casing, eliminating the brittleness problem while maintaining electrical conductivity through the nickel layer
2Reliability
If a nickel termination-pad is directly welded to a titanium casing, then electrical connection is established, but structural integrity deteriorates due to intermetallic formation
Solution Approach 1:
The composite structure of titanium base layer clad-bonded to nickel termination pad prevents intermetallic formation at the weld interface. The titanium base layer ensures compatibility with the titanium casing, eliminating the formation of brittle intermetallic compounds while the nickel termination pad maintains electrical connection functionality
Solution Approach 2:
The titanium base layer serves as a mediator that prevents direct contact and bonding between nickel and titanium at the weld interface. This intermediary layer eliminates the chemical reaction that produces intermetallics, thereby ensuring long-term structural stability and connection durability without compromising electrical conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The clad-bonded connection provides a strong and durable link between the nickel termination-pad and titanium casing, ensuring extended reliability and performance in implantable medical devices.
Implementation Method 1
The present invention provides a nickel termination-pad that is clad-bonded to a titanium base layer
Implementation Method 2
the titanium base layer of the termination-pad is welded to the casing tab
Data Source
AI summary
A nickel termination-pad that has been clad-bonded to a titanium base layer electrically contacted to a casing to thereby serve as a surface for a device manufacturer to connect electronic circuit to the capacitor is described. The clad connection of the nickel termination-pad to the titanium base layer is both robust and provides good electrical conductivity between the dissimilar metals.