Nip Formation Member Securing Mechanism for Thermal Equalization
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Solution Overview
Problem
The structural engagement of the base and high thermal conduction member in existing nip formation members can lead to assembly errors, affecting the accurate positioning and thermal equalization in fixing devices.
Innovation Solution
A nip formation member comprising a base, a high thermal conduction member, and a securing member, where the securing member independently restricts the movement of the base relative to the high thermal conduction member, ensuring accurate positioning and thermal equalization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If structural engagement is used to connect the base and high thermal conduction member, then the components are secured together, but assembly errors increase and positioning accuracy deteriorates
Solution Approach 1:
A positioning pin is introduced as an intermediary component between the base and the high thermal conduction member. The positioning pin fits into a positioning hole to precisely locate the high thermal conduction member relative to the base, eliminating assembly errors while maintaining secure connection through the separate fastening mechanism.
2Reliability
If structural engagement is used to connect the base and high thermal conduction member, then the components are secured together, but the number of structural features increases device complexity
Solution Approach 1:
The connection function is segmented into two independent tasks: positioning (achieved through the positioning pin and positioning hole) and fastening (achieved through the separate fastening mechanism). This segmentation allows each component to have a simple, dedicated structure rather than requiring a complex integrated engagement feature.
3Reliability
If the high thermal conduction member has restricting portions formed by bending, then engagement is achieved, but manufacturing complexity and potential assembly errors increase
Solution Approach 1:
The positioning pin serves as an intermediary that provides precise location without requiring complex bending operations on the high thermal conduction member. The member can be manufactured as a simpler component that attaches via the positioning pin and fastening mechanism, reducing manufacturing complexity while maintaining engagement reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The securing member secures the base and high thermal conduction member accurately, preventing assembly errors and ensuring effective thermal equalization across the fixing belt, thereby enhancing the reliability and performance of the fixing device.
Implementation Method 1
a high thermal conduction member having a thermal conductivity greater than a thermal conductivity of the base
Data Source
Figure 1~2
Figure 3
Figure 4A~4B
AI summary
A nip formation member includes a base, a high thermal conduction member, and a securing member. The high thermal conduction member has a thermal conductivity greater than a thermal conductivity of the base. The securing member is independent from the base and the high thermal conduction member. The securing member is configured to restrict movement of the base relative to the high thermal conduction member.