Nitride Ceramic Resin Composite for Thermal Adhesion
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Solution Overview
Problem
Conventional thermal conductive insulating adhesive sheets have limitations in thermal conductivity due to a thermosetting resin layer with low thermal conductivity between ceramics powder particles, and they require separate adhesive layers, which complicates heat dissipation and adhesion in electronic devices during reflow processes.
Innovation Solution
A nitride-based ceramics resin composite body with a thermosetting resin composition impregnated in an incompletely cured state within a porous nitride-based ceramics sintered body, using a specific ratio of epoxy resin to bismaleimide triazine resin and controlling the curing rate and water absorption to enhance thermal conductivity, adhesion, and heat resistance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a thermosetting resin layer is used between ceramics powder particles, then adhesion and ease of operation are improved, but thermal conductivity deteriorates due to the low thermal conductivity of the resin layer
Solution Approach 1:
The patent uses a porous nitride-based ceramics sintered body as the filler material, which maintains high thermal conductivity while allowing thermosetting resin to be impregnated into the pores. This porous structure enables the resin to provide adhesion without forming a continuous low thermal conductivity layer, thus resolving the contradiction between adhesion and thermal conductivity.
Solution Approach 2:
The patent creates a composite material system combining nitride-based ceramics (for thermal conductivity) and thermosetting resin (for adhesion) in a specific configuration where the resin is impregnated into the porous ceramic structure. This composite approach allows both materials to contribute their respective advantages without the resin forming a thermal barrier layer.
2Ease of operation
If conventional thermal conductive insulating adhesive sheets are used, then ease of operation is improved by eliminating separate adhesive layers, but device complexity increases due to complications in heat dissipation and adhesion during reflow processes
Solution Approach 1:
The patent creates a multi-functional material that simultaneously provides thermal conduction, electrical insulation, adhesion, and reflow process stability. The nitride-based ceramics resin composite body performs multiple functions that were previously requiring separate components, thereby reducing device complexity while maintaining ease of operation.
Solution Approach 2:
The patent modifies the curing characteristics of the thermosetting resin by controlling the equivalent ratio of epoxy resin to bismaleimide triazine resin, ensuring the resin remains in an incompletely cured state during impregnation for good adhesion, but can be fully cured during reflow processing for stability. This parameter control resolves the complexity issue during manufacturing processes.
3Strength
If the curing rate of thermosetting resin is increased to improve adhesion, then strength is improved, but heat resistance reliability deteriorates during reflow processes
Solution Approach 1:
The patent performs preliminary impregnation of the thermosetting resin into the porous ceramics sintered body while the resin is in an incompletely cured state, ensuring good penetration and adhesion. The final curing is then completed during the reflow process, which ensures heat resistance reliability. This preliminary action at the right stage resolves the contradiction between adhesion strength and heat resistance.
Solution Approach 2:
The patent controls the equivalent ratio of epoxy resin to bismaleimide triazine resin to maintain the resin in an incompletely cured state during impregnation, providing optimal adhesion. The curing rate is then allowed to increase during the reflow process to achieve full curing and heat resistance reliability. This dynamic parameter control resolves the contradiction between strength and reliability.
4Reliability
If water absorption of thermosetting resin is reduced to improve heat resistance reliability, then reliability is improved, but adhesion deteriorates
Solution Approach 1:
The patent uses a porous nitride-based ceramics sintered body that provides mechanical interlocking with the thermosetting resin through the porous structure. This physical anchoring mechanism provides strong adhesion independent of water absorption characteristics, allowing the use of low water absorption resin to maintain heat resistance reliability without sacrificing adhesion strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The nitride-based ceramics resin composite body achieves improved thermal conductivity, electrical insulation, and adhesion while maintaining heat resistance reliability during reflow processes, effectively addressing the limitations of conventional adhesive sheets.
Implementation Method 1
a porous nitride-based ceramics sintered body having three-dimensionally continuous pores, the sintered body being formed of primary particles of a nitride-based ceramics
Implementation Method 2
a thermosetting resin composition is impregnated in an incompletely cured state in a porous nitride-based ceramics sintered body
Data Source
AI summary
A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.