Nitride Chip Conformal Interconnects for Higher Connection Density
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Solution Overview
Problem
Current nitride semiconductor devices face challenges in improving connection flexibility, density, resistance, and yield rate, making them unsuitable for mass production due to limitations in connection thickness, length, and layout complexity.
Innovation Solution
The implementation of conformal connecting structures on nitride-based chips, which include slanted surfaces and obtuse angles, allows for reduced connection thickness and increased density by covering these surfaces with conductive layers that are electrically connected to conductive pads, enhancing the flexibility and layout of the connection circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional connection structures are used, then the device structure is simple, but the connection density and flexibility are insufficient
Solution Approach 1:
The patent introduces slanted surfaces that connect different planar surfaces at angles, transforming the conventional planar connection interface into a three-dimensional structure. This dimensional change allows conformal connecting structures to wrap around and cover the slanted surfaces, increasing connection density by utilizing vertical and angular spaces rather than only horizontal plane space.
Solution Approach 2:
The connection structure is divided into multiple segments: the slanted surface itself, the conformal connecting structures that cover it, and the conductive pads. This segmentation allows each component to be optimized independently - the slanted surface provides geometric flexibility, while the conformal structures provide electrical connection, enabling higher density without excessive overall complexity.
2Quantity of substance
If connection thickness is reduced to improve density, then the connection density increases, but the manufacturing precision requirements increase
Solution Approach 1:
The patent changes the geometric parameters of the connection interface by introducing slanted surfaces with specific angles. This parameter change allows the conformal connecting structures to achieve better coverage and electrical contact on the slanted surfaces, improving connection effectiveness while managing thickness reduction, thereby balancing density improvement with manufacturability.
3Quantity of substance
If conformal connecting structures are added to improve connection density, then the connection density and flexibility improve, but the device complexity increases
Solution Approach 1:
By utilizing three-dimensional slanted surfaces and conformal structures that wrap around them, the patent achieves higher connection density through spatial optimization. The conformal nature of the connecting structures allows them to adapt to the slanted geometry, providing effective electrical contact without requiring excessive additional components, thus managing complexity while improving density.
Data Source
AI summary
A nitride semiconductor device includes a semiconductor carrier, a first nitride-based chip, and first conformal connecting structures. The first nitride-based chip is disposed over the semiconductor carrier. The semiconductor carrier has a first planar surface. The first nitride-based chip has a second planar surface, first conductive pads, and first slanted surfaces. The first conductive pads are disposed in the second planar surface. The first slanted surfaces connect the second planar surface to the first planar surface. The first conformal connecting structures are disposed on the first planar surface and the first nitride-based chip. First obtuse angles are formed between the second planar surface and the first slanted surfaces. Each of the first conformal connecting structures covers one of the first slanted surfaces of the first nitride-based chip and one of the first obtuse angles and is electrically connected to the first conductive pads.