Nitride Semiconductor Laser Diode High-Temperature Life

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Solution Overview

Problem

Nitride semiconductor laser diodes with InGaN light emitting layers face challenges in achieving long life characteristics, especially at high temperatures, due to increased dislocation density and lattice mismatch, which affects emission wavelength and efficiency.

Innovation Solution

Controlling the concentration of p-type impurity in a predetermined range near the InGaN light emitting layer, allowing dislocations to form while ensuring efficient hole supply, thereby improving life characteristics and maintaining crystal quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the In content in the InGaN light emitting layer is increased to achieve longer emission wavelength (500 nm or greater), then the emission wavelength is extended to green region, but the dislocation density increases and life characteristics deteriorate sharply

Engineering Contradiction:
Improveemission wavelengthVSAvoidlife characteristics
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent changes the chemical composition parameters of the light emitting layer by introducing P elements to form InGaNP alloy, which modifies the band gap structure and allows achieving 500 nm or greater emission wavelength without proportionally increasing In content, thereby reducing dislocation density and improving life characteristics

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite material InGaNP (combining In, Ga, N, and P elements) instead of simple InGaN alloy, leveraging the unique properties of P elements to achieve desired emission wavelength while maintaining crystal quality and reducing harmful dislocations

Inventive Principle:
Principle #40Composite materials

2Temperature

If the In content in the InGaN light emitting layer is increased to achieve longer emission wavelength, then the emission wavelength is extended, but the lattice mismatch with GaN underlayer increases causing dislocation generation

Engineering Contradiction:
Improveemission wavelengthVSAvoidlattice mismatch
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The patent modifies the compositional parameters by incorporating P elements into the InGaN structure to form InGaNP, which changes the lattice constants and band gap energy, enabling wavelength tuning without proportional increase in lattice mismatch

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The P elements act as an intermediary component that mediates between the In content requirement for long wavelength and the lattice mismatch problem, providing a compositional buffer that allows wavelength extension while maintaining structural compatibility with GaN substrate

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If conventional InGaN light emitting layer is used to achieve green emission, then the structure is simple, but the operating life at high temperature is only several tens of hours

Engineering Contradiction:
Improvelayer structureVSAvoidoperating life
Core Design Contradiction:
Device complexityVSDuration of action of stationary object

Solution Approach 1:

The patent employs InGaNP composite material in the light emitting layer, which provides superior thermal stability and dislocation resistance compared to conventional InGaN, extending operating life to several thousand hours at high temperature while maintaining reasonable structural complexity

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent optimizes compositional parameters (P content, In content ratios) in the InGaNP light emitting layer to achieve the right balance between emission wavelength, crystal quality, and thermal stability, enabling long operating life without excessive structural complexity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly extends the operating life of nitride semiconductor laser diodes at high temperatures, achieving several thousand hours of operation while maintaining high light emitting efficiency.

Implementation Method 1

Controlling the concentration of p-type impurity in a predetermined range near the InGaN light emitting layer

Methodology Applied
Scientific EffectDoping: Dopants

Implementation Method 2

nitride semiconductor laser diode using a nitride semiconductor... active layer having a light emitting layer

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 3

increased dislocation density and lattice mismatch, which affects emission wavelength and efficiency

Methodology Applied
Scientific EffectDislocation:

Data Source

PatentEP2461436B1Nitride-semiconductor laser diode
Publication Date: 2020.05.27 NICHIA CORP
  • EP2461436B1 patent drawingFigure 1
  • EP2461436B1 patent drawingFigure 2~3
  • EP2461436B1 patent drawingFigure 4~5

AI summary

A nitride semiconductor laser diode includes a substrate, an n-side nitride semiconductor layer formed on the substrate, an active layer formed on the n-side nitride semiconductor layer and having a light emitting layer including InxAlyGa1-x-yN (0<x<1, 0≤y<1, 0<x+y<1), and a p-side nitride semiconductor layer formed on the active layer. In the nitride semiconductor laser diode, the lasing wavelength of the nitride semiconductor laser diode is 500 nm or greater, dislocations originated in the active layer penetrate through the p-side nitride semiconductor layer, with the dislocation density in the p-side nitride semiconductor layer being 1×106 cm-2 or greater, and the concentration distribution of p-type impuritys in the depth direction is such that, from the light emitting layer toward the surface of the p-side nitride semiconductor layer, the concentration of the p-type impurity reaches a maximum value of 5×1018 cm-3 or greater within a range of 300 nm from the top portion of the light emitting layer which is closest to the p-side nitride semiconductor layer, and after reaching the maximum value, the concentration remains at 6×1017 cm-3 or greater in the above-described range of 300 nm.