Nitride Semiconductor Layer Growth for Stable Breakdown Voltage
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Solution Overview
Problem
Existing nitride semiconductor devices face variations in breakdown voltage due to fluctuations in carrier concentration in the low concentration carrier region, which are exacerbated by variations in carbon doping during the MOVPE method.
Innovation Solution
The method involves forming the first nitride semiconductor layer using HVPE to control carbon concentration, then switching to MOVPE during the deposition of the second nitride semiconductor layer to maintain a higher carbon concentration, thereby stabilizing carrier concentration and reducing variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the MOVPE method is used to form the low concentration carrier region, then the film can be formed with precise thickness control, but the carrier concentration varies greatly due to carbon doping variations
Solution Approach 1:
The patent changes the growth method parameter from MOVPE to HVPE for forming the low concentration carrier region. HVPE provides lower carbon incorporation rates compared to MOVPE, thereby stabilizing carrier concentration while maintaining adequate thickness control for breakdown voltage requirements.
Solution Approach 2:
The patent substitutes the MOVPE chemical vapor deposition process with the HVPE vapor phase epitaxy process. This replacement fundamentally changes the deposition mechanism to achieve lower carbon doping levels and more stable carrier concentration in the low concentration carrier region.
2Strength
If the low concentration carrier region is formed relatively thick to secure breakdown voltage, then the breakdown voltage is improved, but the variation in carrier concentration becomes more significant
Solution Approach 1:
The patent changes the growth method parameter from MOVPE to HVPE for forming the low concentration carrier region. HVPE provides lower carbon incorporation rates compared to MOVPE, thereby stabilizing carrier concentration while maintaining adequate thickness control for breakdown voltage requirements.
3Reliability
If carbon doping is increased in the second nitride semiconductor layer, then the carrier concentration is stabilized, but the on-resistance may increase
Solution Approach 1:
The patent applies different carbon concentrations to different layers: the second nitride semiconductor layer has higher carbon concentration to stabilize carrier concentration, while the low concentration carrier region maintains lower carbon concentration to minimize on-resistance. This localized differentiation optimizes both reliability and energy efficiency.
Solution Approach 2:
The patent optimizes carbon concentration parameters separately for different regions. The second nitride semiconductor layer uses higher carbon doping to stabilize carrier concentration, while the low concentration carrier region uses lower carbon doping to maintain low on-resistance, achieving a balance between reliability and energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a nitride semiconductor device with low on-resistance and high breakdown voltage by suppressing fluctuations in carrier concentration, achieved through controlled carbon and oxygen doping.
Implementation Method 1
forming the first nitride semiconductor layer using HVPE to control carbon concentration
Implementation Method 2
switching to MOVPE during the deposition of the second nitride semiconductor layer to maintain a higher carbon concentration
Data Source
AI summary
A method of manufacturing a nitride semiconductor device according to one or more embodiments is disclosed that includes forming a first nitride semiconductor layer, forming a second nitride semiconductor layer having a higher carrier concentration than the first nitride semiconductor layer on the first nitride semiconductor layer, forming a third nitride semiconductor layer on the second nitride semiconductor layer, forming a fourth nitride semiconductor layer on the third nitride semiconductor layer, forming a first main electrode electrically connected to the first nitride semiconductor layer, forming a second main electrode electrically connected to the fourth nitride semiconductor layer, and forming a control electrode on the third nitride semiconductor layer via an insulating film. In one or more embodiments, during the forming the second nitride semiconductor layer, the second nitride semiconductor layer is formed with higher carbon concentration than the carbon concentration of the first nitride semiconductor layer.


