Nitride Semiconductor PCB Press-Fit Module for Thermal Dissipation
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Solution Overview
Problem
Nitride semiconductor devices face reliability issues due to thermal dissipation problems and parasitic impedance in conventional packaging methods, which limit their performance in high power switching and high frequency applications.
Innovation Solution
A nitride-based semiconductor module is designed with a nitride-based device pressed-fit into a cavity on a printed circuit board, eliminating the need for soldering and enhancing thermal dissipation by allowing heatsinks to be mounted on the device, while the device's conductive paths connect electrically with the board's conductive leads, forming a plug-socket interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used to connect nitride semiconductor device to PCB, then electrical connection is established, but reliability deteriorates due to thermal expansion mismatch and solder joint degradation
Solution Approach 1:
The patent removes the soldering process entirely from the packaging methodology. Instead of using solder to connect the nitride semiconductor device to the PCB, the invention employs a direct mechanical insertion method where the device is pressed into a cavity formed in the PCB, completely eliminating solder joints and their associated reliability issues.
Solution Approach 2:
The patent replaces the thermal-mechanical soldering process with a purely mechanical insertion system. The device package includes a cavity-receiving structure that mechanically engages with a corresponding protrusion on the PCB, substituting the complex soldering operation with a simple press-fit mechanical connection.
2Temperature
If conventional packaging is used for nitride semiconductor device, then device is protected, but thermal dissipation is insufficient for high power applications
Solution Approach 1:
The patent merges the electrical connection function and thermal dissipation function into a single integrated structure. The PCB cavity serves dual purposes: providing mechanical support for the device while simultaneously acting as a thermal conduction path from the device to the PCB and ultimately to the heatsink, eliminating the need for separate thermal management components.
Solution Approach 2:
The PCB cavity structure is designed to perform multiple functions simultaneously: mechanical support, electrical connection through conductive paths, and thermal dissipation. This multi-functional design simplifies the overall package structure while improving thermal management efficiency for high power applications.
3Reliability
If leaded package is used for nitride semiconductor device, then electrical connection is provided, but parasitic impedance limits high frequency performance
Solution Approach 1:
The patent transitions from traditional planar lead-based connections to a three-dimensional vertical insertion architecture. The device is inserted vertically into the PCB cavity, with conductive paths extending downward from the device bottom surface, creating a compact vertical electrical connection path that minimizes parasitic inductance and impedance for high frequency operation.
Data Source
AI summary
The present disclosure provides a semiconductor module comprising a semiconductor device removably pressed-fit in a cavity formed in a printed circuit board and methods for manufacturing the same. The semiconductor device and the cavity of the printed circuit board can cooperate with each other and act as an electrical plug and an electrical socket respectively. Soldering the semiconductor device on the printed circuit board can be avoided. Therefore, the packaging process can be more flexible and reliability issues with solder joints can be eliminated. Moreover, heatsink can be mounted on top and/or bottom of the semiconductor device after being received in the cavity of the printed circuit board. Thermal dissipation efficiency can be greatly enhanced.