Nitride Electronic Device Protection Layer Structure
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Solution Overview
Problem
Nitride-based electronic devices face issues with moisture resistance due to delamination of protection layers, leading to reduced stability and reliability, especially in high-voltage applications, and the existing manufacturing processes are complex and increase the number of process operations.
Innovation Solution
A nitride-based electronic device structure with multiple protection layers, where an upper protection layer covers the end of a lower protection layer to prevent exposure and moisture ingress, using a hydrophobic resin material like BCB to enhance moisture resistance without the need for additional openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a resin film is used to prevent moisture permeation, then moisture resistance is improved, but the protection layer may delaminate due to volume changes from humidity and temperature variations
Solution Approach 1:
The protection layer is divided into multiple segments (first protection layer, second protection layer, third protection layer) with different materials and functions. The first layer (inorganic nitride) provides moisture barrier, the second layer (organic resin) provides adhesion and flexibility, and the third layer (resin) provides overall protection. This segmentation allows each layer to address specific issues without causing delamination.
Solution Approach 2:
The protection structure uses composite materials combining inorganic nitride layers with organic resin layers. This composite structure leverages the moisture barrier properties of inorganic materials while incorporating the adhesion and flexibility of organic materials, preventing delamination while maintaining moisture resistance.
2Reliability
If openings are formed to expose the drain electrode pad and prevent protection layer delamination, then reliability is improved, but the manufacturing process complexity increases due to etch stop differences
Solution Approach 1:
The protection layers are designed and formed in advance with predetermined patterns that inherently prevent delamination and control moisture exposure. The first protection layer is formed with a pattern that exposes only necessary portions of the drain electrode pad before subsequent layers are added, eliminating the need for multiple separate opening formation processes.
Solution Approach 2:
Multiple functions (moisture barrier, delamination prevention, electrode pad exposure) are merged into a single integrated protection layer structure. The stacked configuration of three protection layers simultaneously achieves all these functions in one manufacturing sequence, reducing process complexity compared to forming separate openings for each function.
3Object-affected harmful factors
If multiple protection layers are stacked to cover the drain electrode pad, then moisture resistance is improved, but the structure complexity increases
Solution Approach 1:
The protection structure is segmented into three distinct layers with specific materials and functions: first protection layer (inorganic nitride) for moisture barrier, second protection layer (organic resin) for adhesion and flexibility, and third protection layer (resin) for overall protection. This segmentation provides clear functional differentiation while maintaining a manageable structure.
Solution Approach 2:
Each protection layer has different local properties tailored to its specific function: the first layer uses inorganic nitride with high moisture barrier properties in critical areas, the second layer uses organic resin with good adhesion properties, and the third layer uses resin for comprehensive protection. This local quality optimization achieves effective moisture resistance without unnecessary structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents moisture from entering the device, improving its stability and reliability while simplifying the manufacturing process by reducing the number of operations required.
Implementation Method 1
using a hydrophobic resin material like BCB to enhance moisture resistance
Data Source
AI summary
The present invention relates to a nitride-based electronic device and a method for manufacturing same, the nitride-based electronic device comprising a substrate, a metal electrode and a plurality of protection layers, wherein, among the protection layers, at least two protection layers covering one portion of the electrode so that one portion of the upper part of the electrode is exposed are configured so that the upper protection layer covers the end part of the lower protection layer so as to prevent the end part of the lower protection layer from being exposed.