Nitride Semiconductor Transistor with Segmented P-type Layers

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Solution Overview

Problem

Nitride semiconductor transistors struggle with current collapse, leading to increased on-resistance and power loss, which limits their effectiveness as normally-off type power transistors.

Innovation Solution

A transistor structure is designed with a p-type AlGaN layer between the undoped AlGaN layer and the p-type GaN layer, and a first p-type semiconductor layer is placed between the gate electrode and the drain electrode, with the second p-type semiconductor layer below the gate electrode, to widen the threshold voltage difference and prevent current collapse, while minimizing leakage current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the thickness of AlGaN barrier layer or Al content is decreased to achieve normally-off characteristics, then the transistor exhibits normally-off behavior, but on-resistance increases and power loss increases

Engineering Contradiction:
Improvenormally-off characteristicsVSAvoidpower loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The p-type semiconductor layer acts as an intermediary structure between the gate electrode and the AlGaN barrier layer. By introducing this intermediate layer with controlled thickness and doping, the patent achieves normally-off characteristics without significantly degrading the on-state performance. The intermediary layer modulates the electric field distribution, allowing normally-off behavior while maintaining low on-resistance and reducing power loss.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a p-type AlGaN layer is added between undoped AlGaN and p-type GaN to prevent current collapse, then current collapse is prevented, but leakage current increases

Engineering Contradiction:
Improvecurrent collapse preventionVSAvoidleakage current
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The p-type semiconductor layer is segmented into two regions with distinct functions. The first region (between gate and drain) prevents current collapse, while the second region (between gate and source) is specifically designed to suppress leakage current. This segmentation resolves the contradiction by allowing the structure to simultaneously achieve current collapse prevention and leakage current reduction through spatially differentiated functionality.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed structure effectively prevents current collapse and reduces leakage current, maintaining drain current even under high voltage conditions, thus enhancing the performance of normally-off type nitride semiconductor transistors.

Implementation Method 1

the heterojunction of the nitride semiconductor is characterized in that by spontaneous polarization or piezoelectric polarization, carriers with a high concentration are generated at its heterointerface

Methodology Applied
Scientific EffectSpontaneous polarization: Polarisation

Implementation Method 2

the heterojunction of the nitride semiconductor is characterized in that by spontaneous polarization or piezoelectric polarization, carriers with a high concentration are generated at its heterointerface

Methodology Applied
Scientific EffectPiezoelectric polarization: Piezoelectric Effect

Data Source

PatentUS7663161B2Transistor for preventing current collapse and having improved leakage current characteristics and method for fabricating the same
Publication Date: 2010.02.16 PANASONIC HOLDINGS CORP
  • US7663161B2 patent drawing
  • US7663161B2 patent drawing
  • US7663161B2 patent drawing

AI summary

A transistor includes: a first semiconductor layer and a second semiconductor layer with a first region and a second region, which are sequentially formed above a substrate; a first p-type semiconductor layer formed on a region of the second semiconductor layer other than the first and second regions; and a second p-type semiconductor layer formed on the first p-type semiconductor layer. The first p-type semiconductor layer is separated from a drain electrode by interposing therebetween a first groove having a bottom composed of the first region, and from a source electrode by interposing therebetween a second groove having a bottom composed of the second region.