Nitrided Glass Core Substrates for Direct Layer Adhesion
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Solution Overview
Problem
Glass cores in semiconductor substrates face challenges with adhesion to subsequent functional layers, requiring intervening adhesive layers that are electrically non-functional and costly, complicating the fabrication process.
Innovation Solution
The glass cores are nitridized to form a nitrided glass interface, enhancing adhesion to dielectric and conductive layers without the need for additional adhesive layers, simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If glass cores are used in semiconductor substrates, then advantages such as low total thickness variation, low coefficient of thermal expansion, low shrinkage, and high modulus are achieved, but adhesion to subsequent functional layers deteriorates
Solution Approach 1:
The glass core surface is nitridized to change its chemical composition and surface properties. This parameter change in the surface chemistry enables subsequent dielectric layers to bond directly to the glass core without requiring additional adhesive layers, thus resolving the adhesion problem while maintaining the inherent stability advantages of glass cores
Solution Approach 2:
The patent creates a composite structure where a nitrided glass surface layer is formed on the glass core. This composite approach combines the dimensional stability of glass with enhanced surface adhesion properties, eliminating the need for separate adhesive layers that would otherwise be required
2Strength
If intervening adhesive layers are formed between glass cores and subsequent functional layers, then adhesion is improved, but fabrication complexity and costs increase
Solution Approach 1:
The patent extracts and eliminates the need for separate adhesive layers by directly modifying the glass core surface through nitridization. This removal of unnecessary intermediate layers simplifies the fabrication process while maintaining strong adhesion between the glass core and subsequent functional layers
Solution Approach 2:
The glass core surface is pre-treated with nitridization before subsequent layer deposition. This preliminary action modifies the surface properties in advance, enabling direct bonding of dielectric layers to the glass core without requiring additional adhesive layers during the fabrication process
3Strength
If intervening adhesive layers are formed between glass cores and subsequent functional layers, then adhesion is improved, but fabrication costs increase
Solution Approach 1:
The patent eliminates the need for expensive adhesive layers by directly nitridizing the glass core surface. This extraction of unnecessary intermediate materials reduces material costs and simplifies the manufacturing process, making glass core substrates more economically viable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves adhesion between glass cores and subsequent layers, eliminates the need for non-functional adhesive layers, and reduces fabrication complexity and costs, while maintaining adhesive properties.
Implementation Method 1
The glass cores are nitridized to form a nitrided glass interface, enhancing adhesion to dielectric and conductive layers
Data Source
AI summary
Substrates with nitrided glass cores, and methods of forming the same, are described herein. In one example, a substrate includes one or more glass layers and a plurality of dielectric layers. At least one of the glass layers includes nitrogen. Further, at least one of the dielectric layers is above the one or more glass layers and at least one of the dielectric layers is below the one or more glass layers.