Nitrided NiCu Adhesion Layer for Wiring Board Resin Bonding
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Solution Overview
Problem
Conventional Cu wiring boards often experience insufficient adhesion strength between the adhesion layer and the resin insulating layer, leading to separation issues, even when using NiCu alloy adhesion layers, due to varying resin types.
Innovation Solution
A nitrided NiCu alloy is used as the adhesion layer, with a nitrogen content of 0.5 to 5.0 atoms% and Ni content of 20 wt% to 75 wt%, enhancing adhesion strength and allowing for etching with a Cu etchant, thereby preventing separation from the insulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesion layer is formed by an NiCu alloy to improve adhesiveness between an insulating layer and an adhesion layer, then adhesiveness is improved, but sufficient adhesiveness may not be obtained depending on a type of resin forming the insulating layer
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesion layer by introducing nitrogen to form a nitrided NiCu alloy. This parameter change (adding nitrogen) fundamentally alters the material properties to achieve universal adhesion across different resin types, resolving the insufficiency of conventional NiCu alloys.
Solution Approach 2:
The patent creates a composite material system by combining NiCu alloy with nitrogen to form a nitrided NiCu alloy adhesion layer. This composite approach integrates multiple elements (Ni, Cu, N) to achieve enhanced and universal adhesion properties that single-element or simple alloy layers cannot provide.
2Strength
If an adhesion layer is provided between an insulating layer and a Cu wiring layer to fix the Cu wiring layer, then the Cu wiring layer is prevented from separating, but the adhesion layer itself may separate from the resin insulating layer due to insufficient adhesion strength
Solution Approach 1:
The patent modifies the chemical composition of the adhesion layer by nitriding the NiCu alloy, changing its properties to achieve strong bonding with resin insulating layers. This parameter change eliminates the separation problem while maintaining the layer's function of fixing the Cu wiring layer.
3Strength
If a nitrided NiCu alloy is used as the adhesion layer to improve adhesion strength, then adhesion strength is significantly improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The patent applies preliminary nitriding treatment to the NiCu alloy adhesion layer during the manufacturing process. This preliminary action of nitriding is integrated into the existing manufacturing flow, allowing the complex material treatment to be performed in advance as part of the standard process rather than as a separate additional step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The nitrided NiCu alloy significantly improves the adhesion strength between the adhesion layer and the insulating layer, ensuring the adhesion layer is not separated, and allows for simultaneous removal of unnecessary portions using a Cu etchant, reducing manufacturing costs.
Implementation Method 1
the adhesion layer is formed by a nitrided NiCu alloy
Implementation Method 2
adhesion strength of the adhesion layer to an insulating layer is improved
Data Source
AI summary
A wiring board includes a substrate having a surface made of an insulating resin. An adhesion layer is formed on the substrate. A wiring layer is formed on the adhesion layer. The adhesion layer is formed by a nitrided NiCu alloy containing nitrogen therein. A nitrogen content of the nitrided NiCu alloy is within a range from 1 atoms % to 5 atoms %.