Nitrogen-Doped MgO Resistive Switching for Scalable Non-Volatile Memory

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Solution Overview

Problem

The scaling of FLASH memory to higher capacities is challenged by the difficulty in maintaining long-term charge storage due to the complexity of scaling tunnel oxide, necessitating the development of alternative scalable non-volatile memory technologies.

Innovation Solution

The use of nitrogen-doped MgO resistive switching elements, which exhibit a high resistance ratio and allow for voltage-controlled switching between 'ON' and 'OFF' states without the need for an initialization step, enabling efficient data storage and rewriting capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If FLASH memory is scaled to higher capacities, then storage capacity increases, but tunnel oxide scaling becomes difficult and charge storage capability deteriorates

Engineering Contradiction:
Improvestorage capacityVSAvoidcharge storage capability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent changes the material parameter from conventional FLASH memory tunnel oxide to nitrogen-doped MgO, which exhibits different electrical properties including higher breakdown field and controlled resistive switching behavior. This material substitution enables scaling while maintaining charge storage capability through its unique defect structure and switching characteristics

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses composite structure combining MgO with nitrogen doping, creating a material with enhanced properties. The nitrogen-doped MgO forms a composite system where nitrogen atoms substitute oxygen sites, creating oxygen vacancies and defect states that enable non-volatile resistive switching while maintaining structural integrity at scaled dimensions

Inventive Principle:
Principle #40Composite materials

2Reliability

If nitrogen content in MgO is increased, then resistive switching performance improves, but material composition control becomes more difficult

Engineering Contradiction:
Improveresistive switching performanceVSAvoidnitrogen content control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary nitrogen doping during the MgO deposition process itself, rather than attempting to control nitrogen content after fabrication. By incorporating nitrogen during the initial material formation through plasma-enhanced deposition or ion implantation before device operation, the defect structure is pre-established, enabling reliable resistive switching without requiring precise post-fabrication composition control

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The nitrogen-doped MgO resistive switching elements demonstrate reliable and scalable non-volatile memory performance with high resistance ratios and low power consumption, suitable for various memory applications, including multi-level programming and synaptic device functionality.

Implementation Method 1

resistive switching elements each of which is in electrical communication with a word line and a bit line. Each of the elements includes a nitrogen (N)-doped MgO dielectric layer

Methodology Applied
Scientific EffectResistive switching: Electrical Resistance

Implementation Method 2

The method comprises applying voltage to the element, thereby changing its resistance state

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20110140762A1Resistive Switching in Nitrogen-doped MgO
Publication Date: 2011.06.16 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US20110140762A1 patent drawing
  • US20110140762A1 patent drawing
  • US20110140762A1 patent drawing

AI summary

Nitrogen-doped MgO insulating layers exhibit voltage controlled resistance states, e.g., a high resistance and a low resistance state. Patterned nano-devices on the 100 nm scale show highly reproducible switching characteristics. The voltage levels at which such devices are switched between the two resistance levels can be systematically lowered by increasing the nitrogen concentration. Similarly, the resistance of the high resistance state can be varied by varying the nitrogen concentration, and decreases by orders of magnitude by varying the nitrogen concentrations by a few percent. On the other hand, the resistance of the low resistance state is nearly insensitive to the nitrogen doping level. The resistance of single Mg50O50-xNx layer devices can be varied over a wide range by limiting the current that can be passed during the SET process. Associated data storage devices can be constructed.