Nitrogen-Implanted Gold-Nickel Layer for Hardness and Conductivity
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Solution Overview
Problem
Gold alloys used in goldsmithing and electronics face challenges in maintaining mechanical hardness and conductivity while being prone to tarnishing and wear.
Innovation Solution
A gold-nickel layer with nitrogen inserts is created through ion implantation, where the layer has a gold dominant surface and a nickel dominant substrate, with nitrogen ions implanted to enhance mechanical properties and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If gold is alloyed with other elements to improve hardness and mechanical resistance, then mechanical properties are improved, but electrical conductivity deteriorates
Solution Approach 1:
The invention changes the chemical composition parameters by introducing nitrogen atoms into the gold alloy lattice through ion implantation. This creates a gold-nickel-nitrogen alloy where nitrogen acts as an interstitial element that strengthens the material through lattice distortion and precipitation hardening, while maintaining the face-centered cubic structure that enables electrical conductivity. The specific composition range (0.1-10 at% Ni, 0.01-5 at% N) is optimized to balance hardness improvement with conductivity preservation.
Solution Approach 2:
The invention creates a composite alloy system combining gold, nickel, and nitrogen. The gold-nickel-nitrogen alloy leverages the beneficial properties of each component: gold provides electrical conductivity and corrosion resistance, nickel enhances mechanical strength through substitutional solid solution strengthening, and nitrogen contributes to hardening through interstitial positioning and precipitation. This composite approach allows simultaneous improvement of mechanical properties while maintaining electrical performance.
2Strength
If gold alloy surface is hardened to prevent scratches, then mechanical resistance is improved, but chemical resistance to tarnishing deteriorates
Solution Approach 1:
The invention modifies the surface composition parameters by creating a gold-nickel-nitrogen alloy layer with controlled concentrations. The nitrogen content (0.01-5 at%) and nickel content (0.1-10 at%) are specifically tuned to form a hardened surface layer that maintains chemical inertness. The face-centered cubic crystal structure preservation and controlled phase formation ensure that the hardened surface does not create reactive sites that would promote tarnishing from sweat, chlorine, or acids.
3Reliability
If pure gold is used to maintain electrical conductivity, then electrical properties are improved, but mechanical hardness deteriorates
Solution Approach 1:
The invention introduces controlled amounts of nickel (0.1-10 at%) and nitrogen (0.01-5 at%) into the gold alloy to modify its mechanical properties while preserving electrical conductivity. The low concentration of alloying elements maintains the dominant gold matrix and its excellent electrical properties, while the nickel and nitrogen provide solid solution strengthening and precipitation hardening mechanisms that significantly improve hardness and mechanical resistance.
Solution Approach 2:
The gold-nickel-nitrogen alloy creates a composite material system where the gold matrix provides the electrical conductivity pathway, while dispersed nickel atoms and nitrogen compounds provide mechanical reinforcement. The face-centered cubic structure is maintained to ensure electron transport, while the alloying elements create lattice distortion and precipitation that impede dislocation motion, thereby improving hardness without sacrificing electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The gold-nickel-nitrogen alloy achieves improved mechanical hardness and chemical resistance while maintaining electrical conductivity similar to pure gold, reducing the need for excessive gold usage.
Implementation Method 1
it implements a device for ion implantation of a piece of gold alloy from a beam of nitrogen ions emitted by an ion source
Data Source
AI summary
A gold nickel layer may comprise nitrogen inserted over a thickness equal to or greater than 0.20 nm, characterized in that the atomic concentration of gold is at least 15% over said thickness, the atomic concentration of nickel is at least 10% over said thickness and the atomic concentration of nitrogen is at least 5% over said thickness. A connector may comprise a portion of a surface which comprises such a gold nickel layer. A process for treating a gold nickel layer may comprise a step of implantation of nitrogen ions, emitted by an energy source of at least 20 keV, and wherein the implanted nitrogen ions are multi-energy ions.