Nitrogen Heterocyclic Photoresist Rectangular Resist Patterns

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Solution Overview

Problem

Conventional chemically amplified positive-type photoresist compositions struggle to form resist patterns with a rectangular cross-sectional shape, which is desirable for connection terminals and Cu-rewiring in high-density packaging technologies, due to limitations in achieving the necessary shape and adhesiveness.

Innovation Solution

Incorporating a nitrogen-containing aromatic heterocyclic compound with a specific structure and Log S value of −6.00 or less into the chemically amplified positive-type photosensitive resin composition, which includes an acid generator and a resin with increased alkali solubility, to facilitate the formation of a rectangular resist pattern.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If conventional chemically amplified positive-type photoresist compositions are used, then the photoresist layer can be formed and patterned, but the cross-sectional shape of the resist pattern cannot be rectangular

Engineering Contradiction:

Improvecross-sectional shape of resist patternVSAvoidshape control precision

Core Design Contradiction:

ShapeVSManufacturing precision

Solution Approach 1:

The invention changes the chemical composition parameters of the photoresist by incorporating a nitrogen-containing aromatic heterocyclic compound with specific structural features (formula 1 or 2) and controlled content (0.1-10 wt% relative to solid content). This parameter change enables the resist pattern to achieve a rectangular cross-sectional shape during development, directly resolving the shape control issue.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite photoresist system by combining the nitrogen-containing aromatic heterocyclic compound with conventional photoresist components including acid generators, bases, and resins. This composite material approach allows the resist pattern to achieve rectangular cross-section while maintaining the chemical amplification mechanism, solving both shape control and manufacturability requirements.

Inventive Principle:

Principle #40Composite materials

2Strength

If the resist pattern cross-sectional shape is not rectangular, then the photoresist can be easily formed, but the adhesiveness of connection terminals and Cu-rewiring is insufficient

Engineering Contradiction:

Improveadhesiveness of connection terminalsVSAvoidcross-sectional shape of resist pattern

Core Design Contradiction:

StrengthVSShape

Solution Approach 1:

By modifying the photoresist composition to include the nitrogen-containing aromatic heterocyclic compound, the invention changes the physical and chemical parameters of the developed resist pattern. This results in a rectangular cross-sectional shape that provides improved mechanical interlocking and adhesion for connection terminals and Cu-rewiring, directly enhancing the strength parameter.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS11550221B2Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and nitrogen-containing aromatic heterocyclic compound

Publication Date: 2023.01.10 TOKYO OHKA KOGYO CO LTD

AI summary

A chemically amplified positive-type photosensitive resin composition including an acid generator which generates acid upon exposure to an irradiated active ray or radiation, a resin whose solubility in alkali increases under the action of acid, and a nitrogen-containing aromatic heterocyclic compound that is a nitrogen-containing aromatic heterocyclic compound having a specific structure and having a Log S value of −6.00 or less.