Nitrogen Plasma Surface Treatment for Resin Film Adhesion
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Solution Overview
Problem
Existing methods for enhancing adhesiveness between heat resistant resin compositions and circuit adhesive members, such as those used in liquid crystal displays, fail to provide reliable adhesiveness under high temperature and high humidity conditions, particularly in thermal shock cycle resistance tests.
Innovation Solution
A plasma treatment using a nitrogen-based gas, including nitrogen, ammonia, or hydrazine, is applied to the semiconductor substrate with a heat resistant resin film, enhancing adhesiveness by introducing chemically stable functional groups, which improves the bonding between the resin film and the circuit adhesive member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If oxygen plasma treatment is applied to enhance adhesiveness between heat resistant resin film and circuit adhesive member, then initial adhesiveness is improved, but long-term reliability under high temperature and high humidity conditions deteriorates
Solution Approach 1:
The patent changes the chemical composition parameter of the plasma treatment gas from oxygen to nitrogen-based gas (nitrogen, ammonia, or hydrazine). This parameter change transforms the chemical nature of the surface treatment, introducing nitrogen-containing functional groups that provide both initial adhesiveness and long-term stability under thermal and humidity stress, thereby resolving the contradiction between initial adhesion strength and long-term reliability.
Solution Approach 2:
The patent creates a composite surface structure by combining the heat resistant resin film with nitrogen-containing functional groups introduced through plasma treatment. This composite surface structure exhibits synergistic properties where the base resin provides structural integrity while the nitrogen-containing groups enhance both adhesion and environmental stability, simultaneously achieving improved adhesiveness and long-term reliability.
2Strength
If plasma treatment is applied to improve adhesiveness, then bonding strength is enhanced, but chemical stability under harsh environmental conditions may be compromised
Solution Approach 1:
The patent modifies the chemical parameter of the plasma gas from oxygen to nitrogen-based gases, which fundamentally changes the type of functional groups introduced on the resin surface. Nitrogen-containing groups such as amines and amides provide both strong bonding capability and enhanced chemical stability against hydrolysis and oxidation under high temperature and humidity conditions, thus achieving both improved bonding strength and maintained chemical stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced adhesiveness is maintained for a long period, even under high temperature and high humidity, resulting in a reliable circuit connection structure with improved thermal and humidity resistance.
Implementation Method 1
a step of surface modification by giving a plasma treatment to a semiconductor substrate having a heat resistant resin film and a first circuit electrode on a surface thereof, using a nitrogen-based gas containing at least one selected from the group consisting of nitrogen, ammonia and hydrazine
Data Source
AI summary
A circuit connection structure that exhibits excellent adhesiveness between a heat resistant resin film and a circuit adhesive member, even under high temperature and high humidity, is provided by introducing a chemically stable functional group into the heat resistant resin film by additional surface treatment to improve adhesiveness. In a circuit connection structure, a semiconductor substrate and a circuit member are adhered by a circuit adhesive member sandwiched therewith. First circuit electrode on the semiconductor substrate and second circuit electrode on the circuit member are connected electrically by conductive particles in the circuit adhesive member. A surface modification is given to the semiconductor substrate by plasma treatment using gas containing nitrogen, ammonia and the like. Therefore, the heat resistant resin film on the semiconductor substrate and the circuit adhesive member are firmly adhered for a long period of time even under high temperature and high humidity.