NiZnCu Ferrite Composition for High Q Multilayer Chip Devices
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Solution Overview
Problem
Existing nickel-zinc-copper (NiZnCu) ferrite compositions for multilayered chip devices face challenges in achieving high quality factor (Q) and low equivalent series resistance (Rs) to enhance the efficiency of these devices, particularly in direct current (DC)-DC converters.
Innovation Solution
A NiZnCu based ferrite composition is developed with specific ranges of bivalent, trivalent, and tetravalent metal additions, including Co, Bi, and Ce, to improve sinterability and quality factor (Q) characteristics, while maintaining a firing temperature of 900°C or less to prevent silver electrode diffusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the firing temperature is increased to improve sinterability and density, then the sintered density increases, but the silver electrode melts or diffuses since Ag has a melting point of 961°C
Solution Approach 1:
The patent modifies the chemical composition parameters of the ferrite material by adding specific amounts of bivalent metal (0.001-0.3 parts by weight), trivalent metal (0.001-0.3 parts by weight), and tetravalent metal (0.001-0.5 parts by weight) to enable effective sintering at lower temperatures (850-950°C) without compromising density or causing electrode damage
Solution Approach 2:
The patent creates a composite ferrite system combining NiZnCu base composition with multiple metal additives (bivalent, trivalent, and tetravalent metals) to achieve synergistic effects that improve sinterability and quality factor while maintaining compatibility with low-melting-point silver electrodes
2Loss of energy
If the quality factor (Q) is increased to reduce equivalent series resistance (Rs) and improve efficiency, then the efficiency of DC-DC converters increases, but the manufacturing complexity increases due to precise composition control
Solution Approach 1:
The patent establishes specific parameter ranges for metal additive contents (bivalent: 0.001-0.3 parts, trivalent: 0.001-0.3 parts, tetravalent: 0.001-0.5 parts by weight based on 100 parts of main component) to optimize the quality factor while providing clear manufacturing guidelines that balance performance with manufacturability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a high quality factor (Q) of 250 or more, improving the efficiency of multilayered chip devices and toroidal cores by optimizing sinterability and reducing Rs, thereby enhancing the performance of DC-DC converters.
Implementation Method 1
a ferrite composition fired at a temperature of 961° C. or less is required in order to implement a chip device. When a firing temperature is 900° C., it is preferable that a sintered density is at least about 4.8 g/cm3 or more
Data Source
AI summary
Disclosed herein are a nickel-zinc-copper (NiZnCu) based ferrite composition containing 0.001 to 0.3 parts by weight of bivalent metal, 0.001 to 0.3 parts by weight of trivalent metal, and 0.001 to 0.5 parts by weight of tetravalent metal based on 100 parts by weight of main component containing 47.0 to 50.0 mol % of Fe2O3, 15.0 to 27.0 mol % of NiO, 18.0 to 25.0 mol % of ZnO, and 7.0 to 13.0 mol % of CuO, and a multilayered chip device and a toroidal core using the same. According to exemplary embodiments of the present invention, a bivalent metal, a trivalent metal, and a tetravalent are contained in a NiZuCu ferrite, thereby making it possible to provide a ferrite composition having excellent quality factor (Q) characteristics. Moreover, it is possible to provide a toroidal core and a multilayered chip device having excellent sinterability, permittivity, and quality factor (Q) characteristics using the ferrite composition.