Noble Metal Deposition Material for Bumping-Free Vacuum Evaporation
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Solution Overview
Problem
The occurrence of the bumping phenomenon during vacuum vapor deposition leads to increased production costs and equipment contamination, particularly in noble metal deposition processes, due to impurities such as iron-based, silicon-based, and carbon-based components.
Innovation Solution
The development of a noble metal vapor deposition material with controlled impurity levels, specifically limiting Fe, Si, and C to less than 10 wt% on the surface and 10 wtppm inside, achieved through precise manufacturing processes using copper crucibles, heat treatment, and thorough pickling to reduce contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum vapor deposition is performed using conventional vapor deposition materials, then deposition can proceed, but the bumping phenomenon occurs causing molten droplets to adhere to the thin film
Solution Approach 1:
The vapor deposition material undergoes preliminary surface treatment including washing with aqua regia and drying before deposition. This preliminary action removes surface impurities and prevents the bumping phenomenon during subsequent vapor deposition, ensuring deposition quality without harmful droplet adhesion
Solution Approach 2:
The invention changes the surface state parameters of the vapor deposition material by controlling surface roughness (Ra ≤ 10 μm) and chemical composition (Fe ≤ 10 wt%, Si ≤ 10 wt%, C ≤ 10 wt%). These parameter changes prevent bumping during vapor deposition while maintaining reliable thin film formation
2Object-generated harmful factors
If impurities are reduced in the vapor deposition material, then bumping is suppressed, but manufacturing complexity increases
Solution Approach 1:
The material undergoes preliminary purification through washing with aqua regia and controlled drying before use. This preliminary action removes impurities (Fe, Si, C) to levels that suppress bumping without requiring complex manufacturing processes, achieving pure vapor deposition material through straightforward chemical treatment
Solution Approach 2:
The invention sets specific parameter thresholds for impurity content (Fe ≤ 10 wt%, Si ≤ 10 wt%, C ≤ 10 wt%) and surface roughness (Ra ≤ 10 μm). These clear parameter specifications enable systematic impurity control through standard washing and drying procedures, avoiding excessive manufacturing complexity while effectively suppressing bumping
3Reliability
If surface roughness is reduced to suppress bumping, then deposition quality improves, but measurement and control difficulty increases
Solution Approach 1:
The invention establishes a clear surface roughness parameter threshold (Ra ≤ 10 μm) that balances bumping suppression with measurability. This parameter level is sufficiently smooth to prevent bumping during vapor deposition while remaining within the reliable measurement range of standard surface roughness instruments, avoiding excessive measurement difficulty
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effective suppression of the bumping phenomenon, reducing substrate contamination and improving production efficiency and yield by minimizing impurity-induced issues.
Implementation Method 1
a thin film is formed by heating a vapor deposition material in a vacuum, and the vapor deposition material that becomes gas molecules adhering to a substrate
Implementation Method 2
The vacuum vapor deposition method is one type of deposition technique, and is a technique in which a thin film is formed by heating a vapor deposition material in a vacuum
Implementation Method 3
When a vapor deposition material is filled in a crucible and melted using an electron beam or the like
Data Source
AI summary
An object of the present disclosure is to provide a noble metal vapor deposition material for use in a vacuum vapor deposition method capable of suppressing the occurrence of the bumping phenomenon during vacuum vapor deposition. Provided is a vapor deposition material composed of a noble metal, wherein, when a surface area of 50 μm×50 μm of the vapor deposition material is analyzed using energy dispersive X-ray spectroscopy, Fe is less than 10 wt %, and when analysis is performed using ICP atomic emission spectroscopy, Fe is 10 wtppm or less.