Noble Metal Plating Surface Irregularities for Semiconductor Adhesion
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Solution Overview
Problem
The reliability of semiconductor devices is compromised in high temperature environments due to reduced adhesive strength between noble metal plating layers and sealing resins, which experience stress from differing thermal expansion coefficients, leading to potential peeling and reduced device reliability.
Innovation Solution
A metal component with a conductive substrate and a noble metal plating layer featuring surface irregularities, where the protrusions have an aspect ratio of 0.3 or more, enhancing bonding strength and adhesive properties to withstand high temperature stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a noble metal plating layer is formed on a metal substrate, then conductivity and heat dissipation are improved, but adhesive strength decreases in high temperature environments
Solution Approach 1:
The patent applies preliminary action by forming surface irregularities on the plating layer before the sealing resin is applied. The protrusions with aspect ratio of 0.05 or more are created in advance through controlled plating conditions, ensuring that when the sealing resin is later applied and cured, it mechanically interlocks with these pre-formed irregularities, thereby maintaining adhesive strength in high temperature environments.
Solution Approach 2:
The patent utilizes a porous-like surface structure by creating protrusions on the plating layer surface. This irregular surface morphology increases the effective surface area and provides mechanical anchoring points for the sealing resin, similar to how porous materials increase surface area and bonding interfaces, thereby improving adhesive strength without compromising the dense bulk structure needed for conductivity.
2Strength
If the plating layer surface is made irregular to improve adhesion, then bonding strength increases, but manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by controlling specific plating parameters (current density, plating time, bath composition) to naturally form protrusions with aspect ratio of 0.05 or more during the electroplating process. This transforms the manufacturing approach from requiring complex post-processing steps to simply adjusting plating parameters, thereby achieving surface irregularities without increasing overall manufacturing complexity.
Solution Approach 2:
The patent utilizes self-service by allowing the plating process itself to create the required surface irregularities through controlled deposition conditions. The plating layer spontaneously forms protrusions during electroplating under specific conditions, eliminating the need for separate surface treatment steps or complex manufacturing processes, thus achieving adhesion improvement without adding manufacturing complexity.
Data Source
AI summary
Provided is a metal component that is configured to be used for manufacturing a semiconductor device, the metal component including: a substrate having a conductivity; and a noble metal plating layer formed on all or part of a surface of the substrate, wherein the noble metal plating layer has a surface with irregularities, and a protrusion of the irregularities has an aspect ratio of 0.3 or more.