NoC Thermal Routing via Node Control Device
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Solution Overview
Problem
Semiconductor devices with Network-on-Chip (NoC) structures face performance degradation due to thermal management throttling, which disrupts communication and reduces routing reliability, as existing methods often require resetting the routing process, leading to inefficient thermal management.
Innovation Solution
A semiconductor device with a node control device that dynamically manages thermal conditions by setting nodes as throttling or communication paths based on temperature, using a router, processor, and throttling controller to calculate temperature parameters, estimate heat, and control communication paths, minimizing re-routing and optimizing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If throttling is applied to manage thermal conditions in each node, then thermal management is achieved, but communication performance degrades and routing reliability reduces
Solution Approach 1:
The patent implements dynamic routing that adapts to thermal conditions in real-time. The routing method dynamically selects paths based on current thermal states of nodes, transitioning between different routing strategies (shortest path, thermal-aware path, alternative path) as thermal conditions change, thereby maintaining routing reliability while managing temperature
Solution Approach 2:
The patent introduces a thermal management controller as an intermediary component that mediates between thermal management requirements and communication routing. This controller receives thermal information from nodes, determines appropriate thermal management actions, and coordinates with the routing system to select paths that avoid overly hot nodes, thus preserving routing reliability while achieving thermal management
2Temperature
If routing is reset from the beginning when throttling occurs, then thermal management is enforced, but overall performance degrades due to re-routing
Solution Approach 1:
The patent performs preliminary thermal assessment before finalizing routing decisions. The system evaluates thermal conditions of candidate nodes in advance and pre-selects appropriate paths that avoid thermal issues, preventing the need for routing resets and maintaining continuous communication flow and overall performance
Solution Approach 2:
The patent changes routing parameters dynamically based on thermal conditions rather than resetting routing entirely. The system adjusts path selection criteria, node temperature thresholds, and routing metrics according to current thermal states, enabling thermal management while maintaining efficient communication and overall system performance
3Speed
If the shortest communication path is set, then communication efficiency is improved, but thermal management becomes difficult when nodes reach critical temperature
Solution Approach 1:
The patent implements dynamic path selection that transitions from shortest path routing to thermal-aware routing based on real-time temperature conditions. When nodes reach critical temperature, the system dynamically switches to alternative paths that bypass hot nodes, maintaining both communication efficiency and thermal management
Solution Approach 2:
The patent incorporates thermal feedback mechanisms where temperature information from nodes is continuously monitored and fed back to the routing system. This feedback enables the system to adjust path selection in response to thermal conditions, avoiding overly hot nodes while maintaining efficient communication through intelligent path rerouting
Data Source
AI summary
A semiconductor device includes a plurality of semiconductor chips vertically stacked and electrically coupled to one another through TSVs (Through-Silicon Vias), a plurality of semiconductor elements formed in each of the semiconductor chips, a plurality of nodes suitable for coupling the semiconductor elements to one another, and a node control device suitable for being provided in each of the nodes, deciding whether to couple the node to a communication path based on a temperature of the node, and setting a shortest communication path among the semiconductor elements.