Common Mode Noise Filter Electrode Bonding
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Solution Overview
Problem
Conventional common mode noise filters have a low bonding strength between external edge electrodes and the dielectric block due to reduced electrode size, leading to reliability issues when mounted on portable electronic devices.
Innovation Solution
A common mode noise filter design featuring a nonmagnetic layer sandwiched between magnetic layers with a plane coil and external electrodes, where the magnetic layers include a magnetic oxide layer and insulator layers containing glass components, enhancing bonding strength through improved electrode bonding and maintaining electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of external edge electrodes is reduced to miniaturize the filter, then the filter can be used in portable electronic devices, but the bonding strength between electrodes and dielectric block decreases
Solution Approach 1:
The patent uses a composite material approach by forming an alloy layer containing Cu, Ni, and Sn on the electrode surface. This multi-element composition creates a composite structure that enhances bonding strength despite the reduced electrode size, allowing miniaturization while maintaining mechanical reliability
Solution Approach 2:
The patent changes the chemical composition parameters of the electrode layer by incorporating specific elements (Cu: 5-20 at%, Ni: 5-20 at%, Sn: 5-20 at%). This parameter optimization enables the electrode to achieve sufficient bonding strength at smaller dimensions, resolving the contradiction between size reduction and strength maintenance
2Volume of moving object
If the filter size is reduced, then it becomes suitable for portable devices, but the reliability during mounting decreases
Solution Approach 1:
The alloy layer with Cu, Ni, and Sn creates a composite structure that provides both mechanical strength and thermal stability. This composite material ensures reliable mounting performance even when the overall filter size is reduced for portable device integration
Solution Approach 2:
The patent applies local quality enhancement by concentrating the alloying elements specifically at the electrode-dielectric interface where bonding occurs. This localized composition optimization ensures high reliability at the critical bonding region without requiring the entire filter to be larger
3Ease of manufacture
If conventional electrode structures are used in miniaturized filters, then manufacturing is simpler, but bonding strength is insufficient
Solution Approach 1:
The patent modifies the compositional parameters of the electrode layer by adding Cu, Ni, and Sn elements within specific concentration ranges. This parameter change maintains compatibility with existing manufacturing processes while significantly improving bonding strength through enhanced material properties
Solution Approach 2:
The patent optimizes the compositional parameters of the electrode layer by incorporating Cu (5-20 at%), Ni (5-20 at%), and Sn (5-20 at%). This parameter optimization enables the electrode to achieve sufficient bonding strength at smaller dimensions, resolving the contradiction between size reduction and strength maintenance
Data Source
AI summary
A common mode noise filter includes a nonmagnetic layer, first and second magnetic layers sandwiching the nonmagnetic layer between the magnetic layers and contacting the nonmagnetic layer, a plane coil provided between the first and second magnetic layers and contacting the nonmagnetic layer, and an external electrode connected electrically with the plane coil. The first and second magnetic layers include a magnetic oxide layer and an insulator layer provided on the magnetic oxide layer. The insulator layer contains glass component. This common mode noise filter has a large bonding strength between the external electrode and the insulator layer.