Non-contact Temperature Calibration Tool for Substrate Support

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Solution Overview

Problem

Existing methods for measuring and calibrating temperature control of substrate supports in processing chambers often introduce contamination and provide inaccurate measurements due to contact-based solutions like thermocouples.

Innovation Solution

The use of non-contact temperature sensors, such as pyrometers, to measure and calibrate temperature control of substrate supports without direct contact, reducing contamination risks and ensuring accurate measurements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If contact-based temperature measurement methods (thermocouples) are used, then temperature calibration can be performed, but contamination is introduced into the processing chamber

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidcontamination
Core Design Contradiction:
Measurement precisionVSObject-generated harmful factors

Solution Approach 1:

The patent replaces contact-based mechanical temperature measurement (thermocouples) with non-contact optical measurement (pyrometer). The pyrometer measures temperature by detecting thermal radiation from the substrate support surface, eliminating the need for physical contact and thus preventing contamination from copper thermocouple materials entering the processing chamber.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces an intermediary medium (optical radiation/thermal radiation) to transfer temperature information from the substrate support to the measurement device. The pyrometer detects thermal radiation emitted by the heated substrate support surface, allowing temperature measurement without direct contact between the measurement device and the substrate support.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If spring-loaded thermocouples are used for temperature measurement, then contact with substrate is achieved, but contact consistency is poor leading to inaccurate measurements

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidcontact consistency
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent eliminates the mechanical contact system (spring-loaded thermocouples) entirely and replaces it with an optical measurement system. The pyrometer measures temperature through thermal radiation detection, removing the reliability issues associated with mechanical contact consistency while maintaining measurement precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for precise temperature calibration of substrate supports without contamination, ensuring accurate and reliable temperature measurements across a wide range, enhancing the accuracy of temperature control in semiconductor processing.

Implementation Method 1

mounting a test fixture having a non-contact temperature sensor on an upper surface of a chamber body of a processing chamber... using the non-contact temperature sensor to measure a calibration temperature of a substrate support

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentEP3596436B1Non-contact temperature calibration tool for a substrate support and method of using the same
Publication Date: 2023.12.20 APPLIED MATERIALS INC
  • EP3596436B1 patent drawingFigure 1
  • EP3596436B1 patent drawingFigure 2
  • EP3596436B1 patent drawingFigure 3

AI summary

Embodiments of the disclosure relate to methods for measuring temperature and a tool for calibrating temperature control of a substrate support in a processing chamber without contact with a surface of the substrate support. In one embodiment, a test fixture with a temperature sensor is removably mounted to an upper surface of a chamber body of the processing chamber such that the temperature sensor has a field of view including an area of the substrate support that is adjacent to a resistive coil disposed in the substrate support. One or more calibration temperature measurements of the area of the substrate support are taken by the temperature sensor and simultaneously one or more calibration resistance measurements of the resistive coil are taken corresponding to each calibration temperature measurement. Temperature control of a heating element disposed in the substrate support is calibrated based on the calibration temperature and calibration resistance measurements.