Non-Contact Chip Pickup Using Self-Peeling Dicing Tape
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Solution Overview
Problem
Conventional methods for picking up chips in flip-chip mounting often result in mechanical or chemical changes to the bonding surface, leading to deteriorated bonding quality due to mechanical contact during the pickup process, which is particularly problematic for room-temperature bonding where high-quality bonding surfaces are required.
Innovation Solution
A manufacturing apparatus that uses a non-contact pickup device with an energy irradiation system to reduce the adhesive force of the dicing tape, allowing for the pickup of chips without mechanical contact, utilizing a UV self-peeling adhesive layer or heat to minimize surface damage and maintain bonding quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a suction nozzle is used to pick up the chip, then the chip can be held and moved, but the bonding surface of the chip is mechanically contacted and deteriorated
Solution Approach 1:
The patent replaces the conventional mechanical suction nozzle contact method with a non-contact pickup method. The pickup head uses a non-contact holding mechanism (such as electrostatic or magnetic field) to hold and move the chip without mechanical contact, thereby preventing damage to the bonding surface while maintaining chip pickup capability
Solution Approach 2:
The patent introduces an intermediary energy field (electrostatic or magnetic field) between the pickup head and the chip. This intermediary field enables force transmission for chip manipulation without direct mechanical contact, solving the contradiction between needing to hold the chip and avoiding surface damage
2Force
If adhesive force of dicing tape is reduced by giving stimulus, then chip can be picked up with small force, but mechanical contact during pickup still occurs
Solution Approach 1:
The patent replaces mechanical contact-based pickup with non-contact field-based holding. Even though the adhesive force is reduced to enable easy release, the actual pickup and movement are performed using non-contact fields, eliminating mechanical contact damage to the bonding surface
Solution Approach 2:
The patent applies preliminary action by reducing the adhesive force of the dicing tape before pickup. This allows the chip to be easily released from the tape with minimal force, and when combined with non-contact holding, ensures no mechanical contact occurs during the pickup process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively prevents quality deterioration of the bonding surface, enabling improved bonding quality between the chip and the target by using energy irradiation to reduce adhesive force, allowing for non-contact pickup with a small suction force.
Implementation Method 1
an energy irradiation device irradiating energy, which is light or heat, in an area-selective manner toward the target chip from a back surface side of the dicing tape to reduce an adhesive force of the dicing tape
Implementation Method 2
an energy irradiation device irradiating energy, which is light or heat, in an area-selective manner toward the target chip from a back surface side of the dicing tape to reduce an adhesive force of the dicing tape
Implementation Method 3
When the adhesive layer is a self-peeling adhesive layer that generates gas upon irradiation with energy
Data Source
AI summary
A manufacturing apparatus (10) for manufacturing a semiconductor device includes: a wafer holding device (12), a PU device (14) having a PU head (40) that holds a target chip (100) in a non-contact manner, an energy irradiation device (16) irradiating energy to the target chip (100) from a back surface side of a dicing tape (130) to reduce an adhesive force of the dicing tape (130), and a controller (22). An adhesive layer of the dicing tape (130) is a self-peeling adhesive layer having an adhesive force that decreases with irradiation of the energy and floats the target chip (100) by a small distance. The controller (22) controls a position of the PU head (40) so that the target chip (100) and the PU head (40) do not come into contact with each other even if the target chip (100) floats during a takeoff preparation period.