Non-Contact PCB Testing via Electromagnetic Coupling
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Solution Overview
Problem
The challenge in testing high-density circuit boards, such as those in vehicle cameras, is the need for reduced test points due to space constraints and potential radiated disturbances, while ensuring comprehensive electrical access for functional testing.
Innovation Solution
The use of non-physically conducting test probes, including capacitive, inductive, and magnetic coupling elements, allows for the acquisition and induction of information from PCB components without physical contact, enabling efficient testing of compact circuit boards with embedded elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical contact test probes (needle probes) are used to test circuit board components, then electrical contact and functional testing is achieved, but space requirements increase and radiated disturbances occur
Solution Approach 1:
The patent replaces the mechanical contact system (physical needle probes making direct electrical contact with test points) with an electromagnetic field-based system (inductive or capacitive coupling probes that sense signals through electromagnetic coupling without physical contact). This substitution eliminates the need for physical contact while maintaining testing capability, thereby reducing space requirements and avoiding radiated disturbances associated with direct electrical contact.
2Reliability
If physical contact test probes are used for in-circuit testing, then direct electrical access is obtained, but radiated disturbances are generated
Solution Approach 1:
The patent substitutes the mechanical electrical contact method with electromagnetic field coupling. Inductive probes sense signals through magnetic field coupling, while capacitive probes sense through electric field coupling, both without direct electrical contact. This eliminates the antenna effect and radiated disturbances that occur when physical probes contact circuit nodes, particularly important for testing RF and high-frequency circuits.
3Reliability
If more test points are provided on high-density circuit boards, then comprehensive testing coverage is achieved, but board complexity and manufacturing difficulty increase
Solution Approach 1:
The patent replaces the need for numerous physical test points and contact probes with electromagnetic field-based sensing. Since the probes couple inductively or capacitively to circuit traces and components, they can sense signals from locations that would be difficult or impossible to access with physical contact, including areas with embedded components and high-density trace routing. This reduces board complexity while maintaining or improving test coverage.
4Ease of operation
If direct physical contact testing is used, then simple testing setup is achieved, but testing of embedded components becomes difficult
Solution Approach 1:
The patent substitutes physical contact-based testing with electromagnetic field-based testing. Inductive and capacitive probes can sense signals through non-conductive materials and around obstacles, enabling access to embedded components that are hidden beneath other structures or surrounded by dense circuitry. The electromagnetic fields penetrate through insulation and coupling structures to reach embedded components, making them accessible for testing without requiring physical contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach maintains high test coverage while minimizing space requirements and avoiding radiated disturbances, allowing for effective testing of complex PCBs, including those with embedded components.
Implementation Method 1
The coupling element couples to components of the PCB circuit without physical contact with the PCB circuit, such as without placing a needle into electrical contact with the PCB circuit. The test includes coupling elements that comprise one of (i) a capacitive coupling element and (ii) an inductive coupling element.
Implementation Method 2
The coupling element couples to components of the PCB circuit without physical contact with the PCB circuit. The test includes coupling elements that comprise one of (i) a capacitive coupling element and (ii) an inductive coupling element.
Data Source
AI summary
A test system for testing a device for use in a vehicle includes a coupling element that is one of (i) a capacitive coupling element, (ii) an inductive coupling element and (iii) a magnetic coupling element. The coupling element is electrically coupled to components of a PCB circuit of a vehicle device to at least one of (a) acquire analog or digital data or information or conditions from the PCB circuit and (b) induce information or conditions into the PCB circuit. The coupling element electrically couples to components of the PCB circuit without physical contact with the PCB circuit. The vehicle device may comprise a vehicle camera.