Non-Contact Sensor for High Frequency Circuit Fault Detection

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Solution Overview

Problem

Conventional fault determination techniques for electronic circuits are ineffective at high frequencies (above 100 MHz) due to the risk of self-generated failures or distortion when using physical contact probes, making it difficult to accurately diagnose faults in RF and microwave circuits.

Innovation Solution

A non-contact system that uses a sensor assembly mounted on a robotic positioning system to measure electromagnetic signals from high frequency circuits, converting them into digitized format for comparison with reference signals from known good circuits, allowing for fault detection without physical contact and providing graphical or tabular displays indicating fault locations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If physical contact probes are used to test circuits, then fault determination can be made for low frequency circuits, but self-generated failures or distortion occurs in high frequency circuits

Engineering Contradiction:

Improvefault determination accuracyVSAvoidself-generated failures or distortion

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent replaces mechanical contact probes with non-contact electromagnetic field sensors. The sensor assembly detects electromagnetic fields emanating from circuit components without physical contact, eliminating the mechanical interaction that causes self-generated failures or distortion in high frequency circuits while maintaining fault determination capability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces electromagnetic fields as an intermediary medium between the testing device and the circuit components. Instead of direct probe-to-component contact, the sensor detects electromagnetic fields that naturally emanate from operating components, serving as a non-invasive mediator that transfers information about component status without causing harmful interactions

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of operation

If conventional test devices are used for high frequency circuits, then testing can be performed, but measurement accuracy deteriorates due to signal distortion

Engineering Contradiction:

Improvetesting capabilityVSAvoidsignature accuracy

Core Design Contradiction:

Ease of operationVSMeasurement precision

Solution Approach 1:

The patent replaces conventional mechanical contact-based test devices with non-contact electromagnetic field sensing. This substitution enables testing of high frequency circuits without the signal distortion and self-generated failures that occur with probe contact, thereby maintaining ease of operation while significantly improving measurement precision for RF and microwave frequency ranges

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables reliable and accurate fault determination in high frequency circuits by comparing measured electromagnetic field signatures with reference values, facilitating effective repair by identifying faults without introducing errors, even in complex and sensitive RF and microwave circuits.

Implementation Method 1

for obtaining electromagnetic signals emanating from the circuit board at selected known locations and for converting said electromagnetic signals into a measured signal value representative of the electromagnetic signals in a digitized format

Methodology Applied

Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS7496466B2System for fault determinations for high frequency electronic circuits

Publication Date: 2009.02.24 HUNTRON INC

AI summary

A positioning system is provided for mounting a circuit board or device to be tested, and for mounting a sensor assembly, the positioning system having the capability of moving the sensor assembly in three dimensions. The sensor assembly is positioned on the mounting assembly such that it is not in contact with the circuit board under test. The sensor assembly in operation samples the electromagnetic field emanating from the circuit under test and converts those signals into a representative electrical signal in a digitized format. A processing system compares the measured values from the sensor assembly with reference values from the same point in a circuit known to be good and provides an indication to the user as to whether the difference therebetween is within an acceptable range or outside thereof.