Non-contact substrate chuck with gas pressure and vacuum retention
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Solution Overview
Problem
Existing chuck systems for integrated circuit fabrication cause physical damage and contamination to substrates due to direct physical contact during retention and processing.
Innovation Solution
A chuck system with a substrate receiving surface featuring gas pressure delivery and vacuum drawing channels, which maintains the substrate in a hovering position above the surface, preventing contact and using pins or annular rings for retention in the X-Y directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is retained by physical contact with the chuck face, then the substrate is reliably held during processing, but the substrate back is damaged and contaminated
Solution Approach 1:
A layer of gas (such as helium or nitrogen) is introduced between the substrate back and the chuck face, serving as an intermediary that prevents direct physical contact. The gas layer maintains a controlled distance (typically 1-10 micrometers) while still allowing the substrate to be retained through gas pressure and vacuum forces, thereby eliminating damage and contamination from direct contact.
Solution Approach 2:
The system uses gas pressure delivery channels to supply pressurized gas against the substrate back, and gas vacuum drawing channels to create vacuum suction. This pneumatic system replaces traditional mechanical contact-based retention with fluid-based forces, allowing reliable substrate holding without physical contact that causes damage.
2Object-affected harmful factors
If gas pressure is delivered against the substrate to prevent contact, then substrate contamination is reduced, but substrate retention stability may be compromised
Solution Approach 1:
The system merges gas pressure delivery and gas vacuum drawing functions into a single integrated chuck structure. Both functions operate simultaneously through separate but coordinated channel systems, creating a balanced force field that maintains substrate stability without contact. The combined effect of pressure from below and vacuum from the sides ensures the substrate remains centered and stable.
Solution Approach 2:
The system dynamically adjusts gas pressure and vacuum levels to optimize both contamination prevention and retention stability. By controlling the parameters of gas flow rate, pressure differential, and vacuum strength, the system maintains the substrate at an optimal distance from the chuck face while ensuring stable positioning during processing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reliably holds substrates without physical contact, minimizing damage and contamination, and allowing for precise positioning and handling during processing.
Implementation Method 1
The substrate receiving surface has gas pressure delivery portions in communication with the gas pressure delivery channels, for delivering a gas pressure against the substrate
Implementation Method 2
The substrate receiving surface also has gas vacuum drawing portions in communication with the gas vacuum drawing channels, for drawing a gas vacuum against the substrate
Data Source
AI summary
A chuck for releasably retaining a substrate, where the chuck has a body with a substrate receiving surface disposed in an X-Y coordinate plane and adapted to receive the substrate. The body has gas pressure delivery channels and gas vacuum drawing channels, where the gas pressure delivery channels and gas vacuum drawing channels are mutually exclusive within the body. The substrate receiving surface has gas pressure delivery portions in communication with the gas pressure delivery channels, for delivering a gas pressure against the substrate while the substrate is retained by the chuck, and thereby keeping the substrate from contacting the substrate receiving surface. The substrate receiving surface also has gas vacuum drawing portions in communication with the gas vacuum drawing channels, for drawing a gas vacuum against the substrate while the substrate is retained by the chuck, and thereby retaining the substrate proximate the substrate receiving surface. Retaining means retain the substrate in X-Y directions from sliding off of the substrate receiving surface.