Non-Contact Wafer Cleaning Module With Vertical Gripper
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Solution Overview
Problem
Conventional wafer cleaning methods like chemical buffing and brush scrubbing often result in particle reattachment, which can prevent wafers from being used in advanced devices, leading to reduced yield due to defects created by these small, loosely attached particles.
Innovation Solution
A non-contact cleaning system utilizing a wafer gripping device with a catch cup and gripper assembly that positions the wafer vertically, applying cleaning fluids and rotating it simultaneously to prevent particle reattachment, combined with air flow control to minimize re-circulation and ensure particles are removed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chemical buffing and brush scrubbing are used to clean wafers, then cleaning effectiveness is improved, but particle reattachment occurs leading to reduced yield
Solution Approach 1:
The patent replaces mechanical cleaning methods (chemical buffing and brush scrubbing) with a non-contact cleaning system that uses controlled air flow and fluid dynamics to remove particles from wafers, eliminating the particle reattachment problem caused by mechanical contact
Solution Approach 2:
The invention employs pneumatic principles by using controlled air flow through a gripper assembly to suspend and manipulate wafers during cleaning, and uses fluid dynamics to create controlled environments that prevent particle reattachment while maintaining cleaning effectiveness
2Reliability
If non-contact cleaning is implemented, then particle reattachment is prevented, but device complexity increases
Solution Approach 1:
The gripper assembly serves multiple functions: it holds the wafer during cleaning, generates controlled air flow for particle removal, and creates a sealed environment to prevent particle reattachment. This multi-functionality reduces the need for separate components, thereby managing system complexity while achieving reliable particle-free cleaning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes particles from wafers, preventing reattachment and ensuring the wafers meet quality standards for use in advanced devices, thereby improving yield by maintaining surface cleanliness during processing.
Implementation Method 1
rotating it simultaneously to prevent particle reattachment
Implementation Method 2
applying cleaning fluids and rotating it simultaneously
Implementation Method 3
combined with air flow control to minimize re-circulation and ensure particles are removed
Data Source
AI summary
A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.