Non-Coplanar Antenna Semiconductor Package EMI Mitigation
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Solution Overview
Problem
The increasing complexity and miniaturization of semiconductor devices lead to higher electromagnetic interference (EMI) due to enhanced processing speeds and higher density integration, which can adversely affect neighboring devices, and pose design constraints for integrated antennas in limited package spaces.
Innovation Solution
A semiconductor package device design featuring a substrate with distinct areas for semiconductor devices and antenna patterns, where the antenna patterns are non-coplanar with the package body, and a shielding cover to mitigate EMI, utilizing a substrate with interconnection structures like redistribution layers (RDL) and conductive shields for electrical connectivity and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor devices are miniaturized and integrated at higher density to reduce package size, then the package device size is reduced, but electromagnetic interference increases due to higher processing speeds and closer device proximity
Solution Approach 1:
The substrate is divided into distinct first and second areas, with semiconductor devices placed on the first area and antenna patterns on the second area. This spatial segmentation separates EMI-generating components from antenna components, reducing electromagnetic interference while maintaining miniaturization benefits.
Solution Approach 2:
Different regions of the substrate are assigned different functional qualities: the first area is optimized for semiconductor device integration with appropriate shielding, while the second area is optimized for antenna patterns with exposed surfaces for RF signal transmission. This local differentiation addresses EMI concerns in specific zones without compromising overall package size.
2Volume of moving object
If antenna patterns are integrated within the semiconductor package to reduce overall system size, then the package device size is reduced, but antenna performance is constrained by limited space and coplanar requirements
Solution Approach 1:
The antenna patterns are positioned on the second area of the substrate and exposed at the surface, creating a non-coplanar relationship between the antenna plane and the package body. This dimensional arrangement provides additional design freedom for antenna patterns without being constrained by the package footprint, enabling better antenna performance in compact packages.
Solution Approach 2:
The antenna patterns are extracted from the traditional coplanar configuration and placed on a separate second area of the substrate that is exposed at the package surface. This extraction allows the antenna design to be optimized independently from the package body geometry, enhancing design flexibility and performance.
3Object-generated harmful factors
If shielding covers are added to protect electronic components from radio frequency signals, then EMI protection is improved, but the package device complexity increases
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support, electrical interconnection through RDL structures, and EMI shielding through its conductive layers. By merging these functions into a single integrated substrate structure, the need for separate shielding components is reduced, thereby protecting electronic components while limiting additional complexity.
Data Source
AI summary
The present disclosure provides a semiconductor package device comprising: (1) a substrate comprising a first area and a second area; (2) a semiconductor device on the first area of the substrate; (3) an antenna pattern on the second area of the substrate; (4) a first electronic component on the antenna pattern; and (5) a first package body encapsulating the first area of the substrate and the semiconductor device and exposing the antenna pattern, the first electronic component and the second area of the substrate. An upper surface of the first package body is non-coplanar with the antenna pattern on the second area of the substrate.