Non-coplanar High-Speed Interconnects for Transponders
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Solution Overview
Problem
High-speed transponders require multiple interconnects, which increase complexity and cost due to the use of coax cable and GPPO or V-Connectors, limiting market potential.
Innovation Solution
The development of multi-channel non-coplanar high-speed interconnects using coplanar transmission lines on printed circuit boards, which connect sets of transmission lines across layers, reducing the need for multiple cables and enabling scalable high-speed data transfer without specialized packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coax cable and GPPO or V-Connectors are used as high-speed interconnects, then reliable high-speed signal transmission is achieved, but device complexity and cost increase
Solution Approach 1:
The patent replaces mechanical cable and connector systems with electromagnetic field-based coplanar transmission lines integrated on a printed circuit board. This substitution eliminates the need for physical coax cables and specialized connectors (GPPO or V-Connectors), thereby reducing device complexity and assembly requirements while maintaining high-speed signal transmission capability through controlled impedance traces and ground reference planes.
Solution Approach 2:
The coplanar transmission line structure serves multiple functions simultaneously: it provides high-speed signal transmission, establishes controlled impedance paths, provides ground reference planes for signal integrity, and enables direct PCB integration. This multi-functionality replaces the separate roles previously fulfilled by coax cables, connectors, and mounting structures, thereby reducing overall system complexity.
2Reliability
If multiple cables are used for differential interconnects, then signal integrity is maintained, but manufacturing cost increases
Solution Approach 1:
The patent merges multiple separate cable and connector assemblies into a single integrated coplanar transmission line structure on the PCB. Differential signal pairs are routed as coupled traces with associated ground planes, eliminating the need for multiple discrete cables and connectors. This consolidation reduces manufacturing complexity, assembly steps, and material costs while preserving signal integrity through controlled impedance design.
Solution Approach 2:
The mechanical cable and connector system is replaced with etched copper traces and ground planes on a PCB substrate. This substitution enables standard PCB manufacturing processes to be used instead of specialized cable assembly and connector installation procedures, significantly reducing manufacturing cost and improving ease of production while maintaining differential signal integrity through proper trace geometry and spacing.
3Speed
If specialized packages with multiple interconnects are used, then high-speed data transfer is enabled, but space efficiency decreases
Solution Approach 1:
The patent transitions from a three-dimensional cable-based interconnect architecture to a two-dimensional planar transmission line architecture on the PCB. Coplanar transmission lines route signals across the PCB surface using ground planes and trace geometry rather than vertical cable assemblies. This dimensional change enables high-speed signal paths to be integrated within the PCB footprint, reducing the overall package area required while maintaining data transfer rates through optimized trace routing and impedance control.
Data Source
AI summary
In one example embodiment, a high-speed package includes first and second layers and a multi-channel non-coplanar interconnect. The first layer includes first and second sets of coplanar transmission lines. The second layer includes third and fourth sets of coplanar transmission lines. The multi-channel non-coplanar interconnect includes first and second channels. The first channel connects the first set of transmission lines to the third set of transmission lines. The second channel connects the second set of transmission lines to the fourth set of transmission lines.