Non-Destructive Semiconductor Defect Detection With Thermal Contrast
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Solution Overview
Problem
Current methods for detecting semiconductor defects require destroying the semiconductor to inspect for defects, which is undesirable.
Innovation Solution
A method using temperature difference contrast to detect defects by applying a heat source to a semiconductor surface, allowing heat diffusion and capturing temperature images without damaging the semiconductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a scanning electron microscope is used to check bonding accuracy by slicing the semiconductor, then defect detection precision is improved, but the semiconductor is destroyed
Solution Approach 1:
The patent replaces the mechanical slicing method with a thermal imaging method. Instead of physically cutting the semiconductor to inspect internal structures, the invention uses infrared thermal imaging to detect temperature differences caused by defects, thereby eliminating mechanical destruction while maintaining detection capability
Solution Approach 2:
The patent changes the detection parameter from physical structure (requiring slicing) to thermal parameter (temperature distribution). By applying heat to the semiconductor surface and measuring temperature differences through thermal imaging, the method detects defects without mechanical intervention
2Measurement precision
If the semiconductor is sliced for inspection, then defect detection capability is improved, but productivity is worsened due to loss of tested samples
Solution Approach 1:
The patent replaces destructive mechanical slicing with non-destructive thermal imaging, allowing the same semiconductor component to be inspected without being destroyed, thereby maintaining productivity while achieving defect detection
Solution Approach 2:
The patent creates a thermal image copy of the semiconductor's internal structure and defect characteristics without physically altering the original. This thermal representation allows complete inspection while preserving the actual semiconductor for further use
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables defect detection in semiconductors without destruction, identifying issues such as conductive wire breaks, misalignments, and material defects through temperature contrast analysis.
Implementation Method 1
the heat source stopping heating part or all of the first surface of the target semiconductor, and part or all of the first surface of the target semiconductor completely diffusing heat in a direction towards part or all of a second surface of the target semiconductor
Implementation Method 2
a thermal imager sensing temperatures of part or all of the first surface of the target semiconductor or temperatures of part or all of the second surface to obtain an image
Data Source
AI summary
A method for detecting semiconductor defect using temperature difference contrast is provided, including the following steps: obtaining an image of the first surface or a second surface of a standard semiconductor; heating part or all of a first surface of a target semiconductor by a heat source; stopping heating part or all of the first surface of the target semiconductor by the heat source; obtaining an image of the first surface or a second surface of the target semiconductor by a thermal imager; and comparing the first surface or the second surface of the standard semiconductor and the first surface or the second surface of the target semiconductor by a detecting unit to determine if the target semiconductor having defects or not. As such, the method can detect the target semiconductor having defects or not with temperature difference contrast under a condition of no damaging the target semiconductor.