Non-drain Differential Cable Ground Pin Structure

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Solution Overview

Problem

The direct soldering of shield conductors to ground pads in differential signal transmission cables during assembly can cause thermal damage and impedance mismatches, limiting package density due to the need for large ground pads to accommodate solder fillets.

Innovation Solution

A non-drain differential signal transmission cable with a ground connecting pin formed from a wire, where the wire is wound around the shield conductor and has a pin portion extending from it, allowing for electrical connection to the ground without direct heat application, thereby reducing thermal stress and enabling smaller ground pads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the shield conductor is directly soldered to the ground pad, then the electrical connection is simple and reliable, but thermal damage occurs to the shield conductor and insulation during soldering

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidthermal damage to shield conductor and insulation

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a ground connecting pin as an intermediary component between the shield conductor and the ground pad. This pin is wound around the shield conductor and extends to connect to the ground pad, serving as a mediator that transfers the electrical connection function while isolating the shield conductor and insulation from direct thermal exposure during soldering operations.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the shield conductor is directly soldered to the ground pad, then the connection process is simple, but large ground pads are required to accommodate solder fillets, limiting package density

Engineering Contradiction:

Improveconnection process simplicityVSAvoidground pad area

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The ground connecting pin acts as a mediator that concentrates the connection point, allowing the solder fillet to form on the pin rather than requiring a large ground pad area. This intermediary structure enables compact ground pad design while maintaining reliable electrical connection.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The ground connecting pin extends in the vertical dimension from the shield conductor to the ground pad, transferring the connection function from a two-dimensional pad surface to a three-dimensional structure. This dimensional transition allows smaller ground pad area while maintaining connection reliability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Device complexity

If the shield conductor is directly soldered to the ground pad, then the electrical connection is straightforward, but impedance mismatch occurs at the cable connecting portion

Engineering Contradiction:

Improveconnection structure complexityVSAvoidimpedance matching precision

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The ground connecting pin serves as an intermediary that provides a controlled transition path for the electrical connection. By winding around the shield conductor and extending to the ground pad, it creates a more gradual impedance transition compared to direct soldering, reducing reflections and impedance mismatch at the cable connecting portion.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution prevents thermal damage to the shield conductor and insulation during soldering and improves package density by allowing for more compact arrangement of cables without impedance mismatches.

Implementation Method 1

a ground connecting pin for electrically connecting the shield conductor to a ground

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

heat can be necessarily conducted from the tip of a soldering iron to the shield conductor 163 and the insulation 162 during the soldering work

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8791366B2Non-drain differential signal transmission cable and ground connection structure thereof

Publication Date: 2014.07.29 PROTERIAL LTD

AI summary

A non-drain differential signal transmission cable includes a pair of signal conductors aligned in parallel, an insulation around the pair of signal conductors, a shield conductor around the insulation, and a ground connecting pin to electrically connect the shield conductor to a ground, the ground connecting pin including a wire. An end portion of the pair of signal conductors is exposed with the insulation and the shield conductor removed. The ground connecting pin includes a winding portion wound around the shield conductor to be electrically connected to the shield conductor, and a pin portion extending from the winding portion and having an elongate shape.