Non-Halogenated Butyl Rubber Patch for Tyre Electronic Member
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing rubber patches for fixing electronic components on high-power and fast-moving vehicle tires face issues with local heating and mechanical stress, leading to potential deformation and instability, particularly due to the use of halogenated butyl rubber which is not chemically stable at high temperatures.
Innovation Solution
A rubber patch based solely on non-halogenated butyl rubber with a specific geometry and a retaining wall design, which reduces hysteresis and maintains mechanical rigidity, preventing residual deformation and local heating, and optionally includes a radio frequency transponder for tire identification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If halogenated butyl rubber is used in the patch, then the patch provides good sealing and adhesion properties, but the patch exhibits high hysteresis leading to localized heating during high-speed driving
Solution Approach 1:
The patent changes the chemical composition parameter of the rubber material from halogenated butyl to non-halogenated butyl rubber. This parameter change reduces the hysteresis of the material, thereby decreasing energy loss and localized heating during high-speed driving while maintaining the necessary sealing and adhesion properties through optimized compound formulation.
2Strength
If halogenated butyl rubber is used in the patch, then the patch provides initial mechanical stability, but the patch undergoes polymer chain breakage at high temperatures leading to residual deformation
Solution Approach 1:
The patent changes the chemical composition from halogenated to non-halogenated butyl rubber, which has superior thermal stability. The non-halogenated structure resists polymer chain breakage at high temperatures, preventing residual deformation while maintaining mechanical strength through optimized compounding and curing processes.
3Measurement precision
If the electronic component mass is increased to improve sensing accuracy, then the sensing precision improves, but the mechanical stresses on the patch increase significantly at high speeds
Solution Approach 1:
The patent changes the material properties of the patch by using non-halogenated butyl rubber with optimized hysteresis characteristics. This allows the patch to better absorb and dissipate the mechanical stresses generated by heavier electronic components during high-speed driving, preventing deformation and maintaining secure attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The non-halogenated butyl rubber patch effectively limits local heating and maintains mechanical stability during high-speed operations, ensuring the electronic component remains securely attached without residual deformation, enhancing the tire's endurance and reliability.
Implementation Method 1
the resulting patch exhibits lower hysteresis than a similar patch made from halogenated butyl rubber, thus limiting localized heating during very high-speed driving
Implementation Method 2
non-halogenated butyl is chemically more stable within the same temperature ranges, preventing polymer chain breakage
Data Source
Figure 1~2
Figure 3~7
Figure 4~5
AI summary
Rubber patch for attaching an electronic member to the surface of a tyre, comprising a running surface and a retention wall which is connected to the running surface and which defines an internal volume which is capable of receiving the electronic member, such that it is based on a non-halogenated butyl rubber and such that the non-halogenated butyl rubber is the only elastomer of the mixture constituting the patch.