Non-hermetic Interconnect for Implantable Medical Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Hermetic interconnects in implantable medical devices (IMDs) are prone to material flex fatigue failure due to relative intermodule motion, leading to reduced device lifetime and potential corrosion issues.
Innovation Solution
A non-hermetic interconnect system that allows for flexible conductor configurations, including separation of conductors by distances such as 1 mm or 1 cm, and uses hermetic feedthroughs like glass to enable energy and communication transfer between modules without a metallic covering, allowing for relative motion and improved flex fatigue life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetic interconnects are used to protect components from corrosion, then reliability is improved, but material flex fatigue failure occurs due to relative intermodule motion
Solution Approach 1:
The interconnect system is divided into separate hermetic feedthroughs (providing corrosion protection) and non-hermetic interconnect portions (providing flexibility). This segmentation allows each component to optimize its function without compromising the other, resolving the contradiction between corrosion protection and flex fatigue resistance.
Solution Approach 2:
The non-hermetic interconnect portion acts as an intermediary between the hermetic feedthroughs, absorbing mechanical stress and relative motion while transmitting electrical signals. This intermediary element protects the hermetic seals from mechanical damage while maintaining electrical connectivity.
2Reliability
If hermetic sealing is used to prevent corrosion, then purity is improved, but flexibility and adaptability to motion are reduced
Solution Approach 1:
The interconnect is segmented into hermetic and non-hermetic portions, allowing the non-hermetic section to provide flexibility and motion adaptability while the hermetic sections maintain corrosion resistance. This segmentation enables both contradictory requirements to be satisfied simultaneously.
Solution Approach 2:
Different portions of the interconnect system have different properties: the hermetic feedthrough portions provide corrosion resistance and electrical isolation, while the non-hermetic interconnect portions provide flexibility and motion accommodation. This local differentiation of properties resolves the contradiction between purity and flexibility.
3Reliability
If conductors are separated by distance to prevent corrosion, then purity is improved, but device complexity increases
Solution Approach 1:
The non-hermetic interconnect portion serves as an intermediary medium that maintains separation between conductors (preventing corrosion) while providing a structured pathway that actually simplifies the overall device architecture by allowing modular assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The non-hermetic interconnect system increases the flexibility and longevity of IMDs by reducing material fatigue and eliminating corrosion risks, enabling a more compact and cosmetically appealing device design that can conform to body surfaces.
Implementation Method 1
The hermetic feedthrough provides an access in a hermetic housing of the at least one of the first and second modules through which the conductor may pass
Implementation Method 2
A conductor in the non-hermetic interconnect may conduct energy, e.g., for power or communication, from the first module to the second module under an applied direct current (DC) voltage
Data Source
AI summary
A modular implantable medical device (IMD) may include a non-hermetic interconnect. The non-hermetic interconnect may electrically couple a first module and a second module of the modular IMD. A conductor in the non-hermetic interconnect may conduct electrical energy from the first module to the second module under an applied direct current (DC) voltage.