Non-Intersecting Wiring Structure for Narrow Bezel TDDI

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Solution Overview

Problem

Current Touch and Display Driver Integration (TDDI) products experience undesired wiring intersections between the driver chip and the touch display panel, leading to parasitic capacitance and a large footprint, which hinders the achievement of a narrow bezel design and affects touch performance.

Innovation Solution

A wiring structure with non-intersecting first and second connection lines in separate wiring layers, arranged in a straight line configuration, where the second span is less than the first, allowing for a reduced footprint and minimized parasitic capacitance, enabling a smaller bezel and improved touch sensitivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wiring lines are arranged in traditional intersecting patterns to connect driver chip to touch display panel, then electrical connectivity is achieved, but parasitic capacitance increases and footprint enlarges

Engineering Contradiction:
Improveelectrical connectivityVSAvoidparasitic capacitance
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent transitions from a planar wiring arrangement to a three-dimensional stacked architecture. First connection lines are disposed in a first plane while second connection lines are disposed in a second plane parallel to and separated from the first plane. This spatial separation in the vertical dimension eliminates intersections between different signal types, reducing parasitic capacitance while maintaining electrical connectivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The wiring structure is segmented into multiple functional layers: a first set of connection lines for display signals in a first plane, and a second set of connection lines for touch signals in a second plane. This segmentation separates different signal types into distinct spatial zones, preventing harmful electromagnetic interference while preserving individual signal integrity.

Inventive Principle:
Principle #1Segmentation

2Reliability

If wiring lines are arranged in traditional intersecting patterns, then connectivity is achieved, but bezel size increases

Engineering Contradiction:
ImproveconnectivityVSAvoidbezel size
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

By utilizing the vertical dimension with stacked planes, the patent compresses the wiring footprint horizontally. The first and second connection lines are arranged in parallel planes rather than intersecting in the same plane, allowing for a more compact lateral layout that reduces bezel size while maintaining all necessary connections.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If wiring lines intersect, then routing flexibility is maintained, but touch sensitivity deteriorates

Engineering Contradiction:
Improverouting flexibilityVSAvoidtouch sensitivity
Core Design Contradiction:
Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent achieves routing flexibility in the horizontal plane while eliminating harmful vertical intersections. First connection lines extend in the first plane and second connection lines extend in the second plane, allowing independent routing optimization for each signal type without mutual interference, thereby preserving touch sensitivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Object-generated harmful factors

If connection lines are arranged in multiple layers, then intersections are eliminated and parasitic capacitance is reduced, but manufacturing complexity increases

Engineering Contradiction:
Improveparasitic capacitanceVSAvoidmanufacturing complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The patent implements a two-plane wiring architecture where first connection lines are formed in a first plane and second connection lines are formed in a second plane. This approach systematically eliminates parasitic capacitance through vertical separation while using standardized multi-layer fabrication techniques, making the increased complexity manageable through established manufacturing processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11630534B2Wiring structure, manufacturing method thereof, and display device
Publication Date: 2023.04.18 ORDOS YUANSHENG OPTOELECTRONICS
  • US11630534B2 patent drawing
  • US11630534B2 patent drawing
  • US11630534B2 patent drawing

AI summary

A wiring structure includes a plurality of first connection lines disposed in a first wiring layer and extending respectively from first ones of the plurality of first electrical contacts to first ones of the plurality of second electrical contacts, the first connection lines not intersecting each other; and a plurality of second connection lines disposed in a second wiring layer and extending respectively from second ones of the plurality of first electrical contacts to second ones of the plurality of second electrical contacts, the second connection lines not intersecting each other. An orthographic projection of any one of the first connection lines onto a plane parallel to the first and second wiring layers does not intersect an orthographic projection of any one of the second connection lines onto the plane.